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 NextGen Epoxy™ Waterborne System
 Liquid Epoxy Resins & Blends
 Epoxy Resin Solutions
 Solid & Powder Grade Resins
 Multi-Functional & Specialty Resins
 Epoxy Novolac Resins
 Epoxy Polyacrylates
 Elastomer Modified Epoxy Resins
 Electrical Laminating Resins
 Technical Data Sheets
 Novolac Resins & Curatives
 Ultra High Molecular Weight Resins
 Cycloaliphatic Epoxy Resins
 Epoxy Functional Modifiers
 Epoxy Waterborne Resins & Curing Agents
 Curing Agents for Epoxy Resins
 Epoxy Casting Systems
 Epoxy Composites for Automotive
 Epoxy Systems for Wind Energy
 Epoxy Vinyl Ester Resins
 Epoxy Precursors - BPA, ECH, and AC

 Chinese Translations
 Starting Formulations
 Shelf Life
 All Technical Data Sheets

Electrical Laminating Resins

EPON™ Electrical Laminating resins are used in the preparation of Printed Circuit Boards (PCB's), and their prepregs and copper clad laminates. A wide range of Hexion products are available for 150 to 180ºC Glass Transition Temperature (Tg) applications. These products use reactive halogen containing materials to impart flammability resistance to PCB's. They may be cured using either Dicycanamide (DICY) or novolac curing agents. Both one-part (resin plus novolac curing agent) and two-part (resin, with DICY or novolac curing agent in the second package) resin systems are available. The novolac cured electrical laminating resins meet the requirements of "Lead-Free" PCB processing. They also offer excellent thermal stability, good Conductive Anodic Filament (CAF) resistance and fast processing. Low Halogen content UL V0 and V1 flammability rating resins and very high Tg laminating resins (for Chip On Board) applications are also available.


In addition, high molecular weight brominated epoxy oligomeric resins are available for use as flame retarding agents for thermoplastic polymers.


See the "Technical Data Sheets" section for information on individual products.


EPON electrical laminating resins are used primarily for preparing flame retarded PCB's with DICY or novolac curing agents. High molecular weight brominated epoxy oligomers from Hexion can also be used as flame retarding agents for thermoplastic polymers.

See the "Applications & Formulations" section for Starting Formulations and additional information.



  • EPON resin products are available in drum quantities through our extensive distributor network.
  • Larger quantities are available directly from Hexion by contacting a Customer Service representative.


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