Low Metals Content and Precise Viscosity Control
Hexion's Durite® novolac resins bring both of these desired advantages to the exacting process of etching ultrafine circuit line patterns into the photoresist surface coating of semiconductor silicon wafers.
The low ionic contents are critical for the reliability of semiconductor chips. Chip makers benefit from the precise viscosity control of Durite® resins. Our customers can formulate photoresist solutions (by addition of photoactive compounds) that offer chip makers an ability to continuously focus on finer line resolution and better aspect ratios.
Hexion offers Durite® cresol novolac resins of ultrahigh purity for the following positive photoresist formulations:
Specific ratios of meta-, para- and ortho-cresol monomers can be developed for demanding applications for properties such as:
Hexion Specialty Chemicals also manufactures ortho-cresol novolacs for use as epoxy intermediates in the production of high performance multifunctional epoxy resins (see Phenolic Novolacs - Epoxy Intermediates).