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Technical Data Sheet

 

Re-issued August 2005

 

 

EPIKURE™ Curing Agent 3055

 

 

Product Description

EPIKURE™ Curing Agent 3055 is an aliphatic amidoamine. Due to its versatility and convenient working characteristics, it should be considered for room temperature curing applications for epoxy resins and in many applications where elevated temperature curing cycles can be used. When EPIKURE 3055 is used as the sole crosslinker, the combining ratio with an epoxy resin can be varied to obtain a wide range of properties. It may also be used in conjunction with other curing agents to vary properties or curing rates.

 

Application Areas/Suggested Uses

  • Adhesives
  • Laminating binders
  • Electrical encapsulants
  • Grouts
  • Floor topping and repair compositions

 

Benefits

  • Low viscosity
  • Complete compatibility with conventional epoxy resins
  • Extended pot life
  • Wide range of combining ratios

 

Sales Specification

Property

Units

Value

Test Method/Standard

Amine value

g/eq

449-473

ASTM D2896

Viscosity at 25°C

cP

150-300

ASTM D2196

Color

Gardner

<13

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Equivalent weight, approx.

 

90

 

Pounds/gallon @ 25 °C

lbs/gal

7.87

ASTM D1475

 

 

 

 

 

 

General Information

EPIKURE Curing Agent 3055 is usually recommended for use with EPON™ Resin 828 at a ratio of 50 parts per 100 parts of resin, but it can be used within a range of 40 to 100 parts per 100 parts of resin, depending on the desired properties of the cured product. Increasing the amount of EPIKURE 3055 improves toughness and flexibility at the expense of tensile strength, moisture resistance and electrical properties particularly at elevated temperatures. Several representative formulations are described in Table 1. For applications requiring very low viscosity, a part or all of the EPON 828 can be replaced with a reactive diluent such as HELOXY™ Modifier 61. As shown in Table 1, such substitution is accompanied by some change in the properties of the cured resin.

 

As with all room temperature curing epoxy resin systems, the gel time and exothermic temperature rise for an epoxy resin composition containing EPIKURE Curing Agent 3055 depend on the size of the batch, the amount and type of filler loading, the ratio of resin to curing agent and the mixing temperature. Cure time at room temperature depends to a large extent on the exothermic temperature rise. In thin sections where exothermic heat is readily dissipated, an overnight cure is required for the composition to reach handling strength and full cure is reached within several days.

 

Developed primarily to cure epoxy resins at room temperature, EPIKURE Curing Agent 3055 can also be used at elevated temperatures. Since elevated temperatures greatly reduce the cure time, the cure schedule should be carefully watched. A comparison of the physical properties of samples cured at room temperature as well as at 100 °C is listed in Columns B and H in Table 1. Except for heat deflection temperature, differences in properties are small, indicating that even though cure may not be complete at room temperature, it is satisfactory for many applications.

 

 

Performance Properties

 

Table 1 / Properties of Systems Cured with EPIKURE™ Curing Agent 3055

 

 

Method

Units

A

B

C

D 1

E

F

G

H

EPON™ Resin 828

 

pbw

100

100

100

100

100

90

80

100

HELOXY™ Modifier 61

 

pbw

---

---

---

---

---

10

20

---

EPIKURE Curing Agent 3055

 

pbw

40

50

60

82

100

50

50

50

 

 

 

---

---

---

---

---

---

---

---

Handling Properties @ 25°C

 

 

---

---

---

---

---

---

---

---

Initial viscosity

 

cP

2,500

1,900

1,700

1,300

1,000

550

225

1,900

Gel Time, 100 gram mass

 

minutes

---

240

---

---

---

---

---

---

 

 

 

 

 

 

 

 

 

 

 

Cured State Properties 2

 

 

 

 

 

 

 

 

 

 

HDT

ASTM D648

°C

70

67

61

42

14

55

37

62

Tensile strength

ASTM D638

psi

8,600

8,300

7,600

5,250

1,850

7,600

4,950

8,000

Tensile elongation at break

 

%

6.0

6.4

6.9

16.0

7.9

6.0

8.0

4.7

Izod impact, notched

ASTM D256

ft.•lb./in.

0.46

0.55

0.84

1.02

2.08

0.60

0.75

0.52

Hardness

Shore D

 

85

83

81

77

55

75

60

---

Water absortion 3

 

%

0.19

0.21

0.29

0.54

1.10

0.30

0.42

---

Weight loss 4

 

 

0.53

0.64

0.72

0.81

1.73

0.95

1.29

0.60

 

 

 

 

 

 

 

 

 

 

 

Electrical Properties

 

 

 

 

 

 

 

 

 

 

Dielectric constant 5

ASTM D150

 

3.57

3.57

3.58

3.62

3.71

3.80

3.88

3.34

Dissipation factor 5

 

 

0.020

0.021

0.032

0.037

0.041

0.025

0.032

0.017

Volume resistivity

 

 

 

 

 

 

 

 

 

 

at 25 °C

 

ohm•cm

1.0(1016)

9.0(1016)

1.0(1014)

8.2(1013)

1.1(1013)

7.0(1014)

1.0(1013)

4.3(1015)

at 66 °C

 

ohm•cm

4.0(1013)

3.7(1013)

8.2(1010)

7.5(109)

<109

2.3(1011)

5.3(109)

7.8(1013)

at 93 °C

 

ohm•cm

2.3(1011)

1.3(1011)

<109

<109

<109

1.9(109)

<109

8.1(1011)

 

 

 

 

 

 

 

 

 

 

 

1 Equal volume ratio.

2 Determined on 1/8" thick test specimens at 25 °C. Systems A, B, C, D, E, and F were cured for 16 hours at 25 °C followed by 2 hours at 100 °C. Systems G and H were cured for 2 weeks at 25 °C.

3 Percent weight gained after 24 hours immersion in water at 25 °C.

4 Percent weight loss after 24 hours at 150 °C.

5 Determined at 106 Hertz.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

EPIKURE Curing Agent 3055 should be stored in tightly sealed containers, in a dry location at normal room temperature. Care should be taken to avoid storage environments resulting in moisture contamination. Exposure to moisture will cause an increase in viscosity and reactivity, the degree of increase depending on the amount of moisture which has been absorbed.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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