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Technical Data Sheet

 

Re-issued September 2006

 

HELOXY™ Modifier 505

 

Product Description

HELOXY™ Modifier 505 is a low viscosity polyepoxide resin that imparts flexibility, impact resistance and thermal shock resistance when incorporated in a wide variety of epoxy formulations.

 

Application Areas/Suggested Uses

  • Stress relieved concrete patching and surfacing compounds
  • Thermal shock resistant potting and dip coating compounds
  • High impact resistant tooling compounds
  • High peel strength adhesives

 

Benefits

  • Compatible with conventional epoxy resins
  • Non-volatile and low odor
  • Excellent water resistance
  • Imparts high flexibility and impact resistance to epoxy systems

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

500 – 650

ASTM D1652

Viscosity at 25°C

cP

250 – 500

ASTM D445

Color

Gardner

6 max.

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density at 25°C

lb/gal

8.5

ASTM D1475

 

 

 

 

 

 

Processing/How to use

 

In blends with unmodified liquid epoxy resins, HELOXY Modifier 505 is generally substituted at concentrations up to 60 percent by weight to provide varying degrees of flexibility. Figure 1 plots the viscosity of such blends as a function of HELOXY Modifier 505 concentrations. Although the combining ratio of the curing agents must be adjusted to compensate for the lower epoxide content (higher WPE) of HELOXY Modifier 505, the same cure schedules can be maintained as the unmodified epoxy resins. The pot life of formulations modified with HELOXY Modifier 505 is normally slightly longer than that of the corresponding base resin.

 

Figure 1 / Viscosity reduction with reactive diluents

 

Heloxy 505 Graph 1

 

 

HELOXY Modifier 505 is a useful flexibilizer for systems cured with aliphatic amines, aromatic amines, anhydrides, polybasic acids and Lewis acids. Compared to polyglycol based flexibilizers, HELOXY Modifier 505 imparts superior electrical properties and water resistance at levels providing equivalent flexibility.

 

Table 1 illustrates the effect of HELOXY Modifier 505 modification on properties of an EPON™ Resin 828/EPIKURE™ 3072 Curing Agent system for ambient temperature use and an EPON 828 anhydride system for elevated temperature cure.

 

Table 1 / Properties of Epoxy Systems Containing HELOXY Modifier 505

 

 

Units

A

B

C

D

E

F

Composition

 

 

 

 

 

 

 

EPON Resin 828

pbw

100

75

60

100

60

40

HELOXY Modifier 505

pbw

---

25

40

---

40

60

EPIKURE Curing Agent 30722

pbw

35

30

36

---

---

---

Hexahydrophthalic Anhydride

pbw

---

---

---

80

58

47

EPIKURE Curing Agent 3253

pbw

---

---

---

1.5

1.5

1.5

 

 

 

 

 

 

 

 

Handling Properties

Viscosity @ 25°C

 

cP

 

4,000

 

1,600

 

1,200

 

1,460

 

400

 

320

Gel Time, @ 25°C, 100 g mass

minutes

40

48

67

---

---

---

Peak Exotherm, 100 g mass

°F

°C

315

157

216

102

202

94

---

---

---

---

---

---

Cure Schedule

 

2 weeks at 25°C

2 hrs at 93°C

followed by 2 hrs at 204°C

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

Tensile Strength (ultimate)

Tensile Elongation

Tensile Modulus

psi

%

ksi

8,900

3

---

5,590

9

---

2,390

25

---

11,600

6.4

---

7,100

10

---

2,750

61

---

 

 

 

 

 

 

 

 

Flexural Strength (ultimate)

Flexural Modulus (initial)

Flexural Deflection

psi

ksi

inches

16,000

480

0.29

9,530

250

>0.6

3,060

70

>0.6

21,200

490

0.41

13,520

350

>0.6

1,460

---

>0.6

 

 

 

 

 

 

 

 

Compressive Strength (yield) 2

psi

13,200

8,900

2,100

---

10,400

<800

Izod Impact, notch

ft.•lb./inch

0.40

0.52

0.95

0.40

0.83

2.8

Hardness

Shore D

86

81

71

90

82

63

 

 

 

 

 

 

 

 

Water Absorption, 24 hrs

%

0.17

0.33

0.66

0.14

0.10

0.19

Weight Loss, 24 hrs at 150°C

%

---

---

---

0.10

0.83

1.71

 

 

 

 

 

 

 

 

Glass Bow Shrinkage 3

(inches divergence from plane surface) 3

inch

>0.400

0.065

0.030

---

---

---

Linear Shrinkage 4

inch/inch

0.0038

0.0031

0.0029

---

---

---

 

 

 

 

 

 

 

 

Electrical Properties

 

 

 

 

 

 

 

Dielectric Constant 5

 

3.97

3.80

4.12

3.52

3.59

3.72

Dissipation Factor

 

0.021

0.015

0.033

0.012

0.013

0.024

Volume Resistivity

at 25°C

at 66°C

at 93°C

at 130°C

at 150°C

at 180°C

at 200°C

 

ohm•cm

ohm•cm

ohm•cm

ohm•cm

ohm•cm

ohm•cm

ohm•cm

 

1.0(1015)

9.9(1012)

2.3(1011)

<109

---

---

---

 

9.3(1014)

2.1(1011)

2.4(109)

<109

---

---

---

 

1.5(1013)

5.2(109)

<109

---

---

---

---

 

>1016

>1016

9.34(1015)

7.12(1014)

1.10(1013)

1.52(1011)

4.42(1010)

 

5.4(1015)

2.2(1015)

7.8(1011)

1.3(1010)

<109

---

---

 

1.1(1015) 1.1(1012)

7.4(1010)

4.9(109)

<109

---

---

 

 

 

 

 

 

 

 

1 Determined on 1/8” thick test specimens

2 Test specimen dimensions –1/2” right cylinder, 1” height.

3 Corps of Engineers test method measuring the curing stress of a 1/8” thick resin layer bonded to a sheet of picture-glass.

4 ERF-12-64. Mold Size 1 (195 ml).

5 Measured at 1 megacycle and 25 °C.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

This product will slowly advance in viscosity and epoxide equivalent weight (EEW) over time, especially when stored above the recommended maximum storage temperature. Refrigerated storage will enhance product stability and thus, extend the product shelf life expectancy.

 

HELOXY Modifier 505 should be stored in tightly sealed containers, in a dry location at normal room temperatures. Some materials can crystallize during storage. The tendency to do so is affected by storage conditions, composition, and other factors. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion, Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/ 

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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