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Technical Data Sheet

 

Re-issued September 2007

 

HELOXY™ Modifier 65

 

Product Description

HELOXY™ Modifier 65 is a commercial grade, glycidyl ether of para-tertiary butyl phenol. It is primarily used as a viscosity reducing modifier in epoxy systems and is particularly useful in epoxy applications requiring combinations of good electrical properties, low viscosity, low volatility and/or low odor levels.

 

Benefits

  • Moderately effective viscosity reducer for higher molecular weight aromatic epoxy resins
  • Good electrical properties
  • Low volatility
  • Low odor

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

225-240

ASTM D1652

Viscosity @ 25 °C

cP

20-30

ASTM D445

Color

Gardner

1

ASTM D1544

Epichlorohydrin

mg/kg

10

SMS 2445

       

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

8.4-8.6

 

 

 

 

 

 

 

General Information

HELOXY 65 is compatible with virtually all classes of epoxy resins used in thermoset plastics and protective coatings applications.

 

As with any monoepoxide, use of HELOXY 65 as a modifier reduces the average epoxide functionality of the epoxy system, thereby lowering cured state chemical and solvent resistance and thermal performance. Since the degree to which performance properties are affected depends on the amount of HELOXY 65 in the formulation, the amount used should be limited to that necessary to yield the required reduction in viscosity. A comparison of the effects on viscosity resulting from modification with Heloxy 65 to that of other representative HELOXY modifiers is illustrated by Figure 1.

 

Curing agents that are recommended for satisfactory crosslinking of unmodified liquid epoxy resins can also be used with compositions containing HELOXY 65. Minor adjustments in curing agent concentration might be required when formulating a HELOXY 65 modified resin due to the slightly lower epoxide content (higher weight per epoxide) of HELOXY 65 relative to most unmodified epoxy systems.

 

As seen when reviewing data in Table 1, which compare the effects of HELOXY 65 modification of epoxy system properties, pot life is lengthened and peak exotherm temperatures are reduced. The highly aromatic structure of HELOXY 65 contributes to a slightly more rigid, less flexible cured state than that developed by an unmodified counterpart. Use of HELOXY 65 generally results in excellent maintenance of, or improvement in, electrical properties when reducing epoxy systems to proper application viscosities.

 

While difficult to predict with certainty due to varying effects of storage conditions and other compositional factors, past studies have shown that HELOXY 65 is among the most effective epoxy functional modifiers in resisting crystallization frequently noted to occur during storage of diluted bisphenol A based epoxy resins.

 

 

Performance Properties

 

Figure 1/Viscosity Reduction Effectiveness of HELOXY Modifiers

 

Heloxy 65 Graph 1

 

 

Table 1/Properties of Epoxy Resin Systems Containing HELOXY Modifier 65

 

Composition

Units

A

B

C

D

E

F

EPON™ Resin 828

pbw

100

80

67

80

67

67

HELOXY Modifier 65

pbw

20

33

20

33

33

EPIKURE™ Curing Agent 3234

pbw

13

12

12

EPIKURE Curing Agent 3072

pbw

34

33

Hexahydrophthalic Anhydride

pbw

73

Diethylaminoethanol

pbw

0.5

 

 

 

 

 

 

 

 

Handling Properties

 

 

 

 

 

 

 

Viscosity, Resin Portion, at 25 °C

cP

11,000

2,300

850

2,300

850

850

Gel Time, 100 g at 23 °C

min.

37

48

56

55

70

1/4-inch thick, at 93 °C

min.

95

Peak Exotherm, 100 g at 23 °C

°C

223

199

196

159

131

 

 

 

 

 

 

 

 

Cured State Properties1

 

 

 

 

 

 

 

Heat Distortion Temperature

°C

106

84

73

60

57

99

Ultimate Tensile Strength

psi

12,300

12,400

9,500

9,100

8,000

12,200

Tensile Elongation at Break

%

4.9

5.0

2.2

2.7

2.4

3.3

Initial Tensile Modulus

ksi

470

480

520

470

450

490

Ultimate Flexural Strength

psi

19,500

20,800

20,100

11,300

10,900

23,100

Initial Flexural Modulus

ksi

480

500

510

460

420

510

Compressive Strength

 

 

 

 

 

 

 

Ultimate

psi

42,000

38,000

36,000

14,500

14,800

32,000

at Yield

psi

16,200

15,000

15,000

no yield

17,300

Izod Impact,notch

ft.•Ib./in.

0.45

0.47

0.46

0.24

0.26

0.46

Weight Loss

 

 

 

 

 

 

 

24 hrs. at 150 °C

%

0.24

0.45

0.82

0.63

1.33

0.20

Percent Absorption2

 

 

 

 

 

 

 

in Water

 

 

 

 

 

 

 

24 hrs.

 

0.16

0.16

0.15

0.17

0.20

0.12

1 week

 

0.38

0.39

0.39

0.43

0.50

0.18

in 5% Acetic Acid

 

 

 

 

 

 

 

24 hrs.

 

0.21

0.20

0.22

0.57

0.55

0.11

1 week

 

0.58

0.61

0.68

1.73

1.77

0.28

in Solvent3

 

 

 

 

 

 

 

24 hrs.

 

0.02

0.01

0.69

7.74

18.18

0.46

1 week

 

0.05

0.05

4.56

2.47

Dielectric Constant4

 

3.91

3.75

3.62

3.61

3.44

3.32

Dissipation Factor4

 

0.031

0.026

0.020

0.013

0.013

0.011

1Determined on 0.125 thick specimens at 23 °C. Systems A through C cured 16 hours at 25 °C plus 2 hours at 100 °C. Systems D and E cured 14 days at 25 °C. System F cured 2 hours at 93 °C plus 2 hours at 200°C.

2Weight gain of 3 inch x 1 inch x 0.125 inch specimens totally immersed in reagent at 25 °C.

350:50 by weight mix of isopropanol and xylene.

4Determined at 106 hertz.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

HELOXY Modifier 65 should be stored in tightly sealed containers, in a dry location at normal room temperatures. Some epoxy resins may crystallize during storage. The tendency to do so is affected by storage conditions, composition and other factors. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/ 

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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