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Technical Data Sheet

 

Re-issued July 2016

 

HELOXY™ Modifier 61

 

Product Description

HELOXY™ Modifier 61 is a commercial grade butyl glycidyl ether. A low viscosity, virtually colorless monoepoxide, it is widely used in the viscosity reducing modification of epoxy resin formulations.

 

Benefits

  • Most efficient epoxy resin viscosity reduction of all common epoxy functional modifiers
  • Outstanding substrate and filler wetting characteristics
  • Excellent retention of physical strength and thermal properties of base formulations

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

140-155

ASTM D1652

Viscosity at 25°C

cP

1-2

ASTM D445

Color

Gardner

<1

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

7.6-7.8

 

 

 

 

 

 

 

General Information

The relatively low molecular weight of HELOXY 61 makes it the most efficient common monoepoxide in reducing the viscosity of basic epoxy resin formulations. A comparison of this property to that of other representative Heloxy modifiers is illustrated in Figure 1.

 

As with any monoepoxide, modification of basic epoxy resins with HELOXY 61 reduces the average functionality of the mixture thereby lowering overall cured state performance. However, due to its excellent viscosity reduction characteristics, relatively low levels of HELOXY 61 are normally needed to attain desired viscosity reductions and these compromises in performance properties are held to a minimum. In any application, the amount of HELOXY 61 used in the formulation should be limited to that necessary to yield the required viscosity reduction. The maximum recommended quantity of HELOXY 61 is about 20 percent by weight of the resin portion.

 

HELOXY 61 is compatible with other epoxy resins in all proportions and is easily blended with liquid resins at room temperature. If preferred, a pre-blend of HELOXY 61 and a standard bisphenol A based liquid epoxy resin at a viscosity selected for easy handling is available as EPON™ Resin 815C. For information on properties and suggested uses of this resin, please consult the appropriate product literature.

 

Curing agents that are recommended for unmodified basic liquid epoxy resins can also be used with compositions containing HELOXY 61. When calculating the proper stoichiometric amount of curing agent to be used with HELOXY 61 modified resins, differences in epoxy content of the resin resulting from this modification are small and can generally be ignored at modification levels below 10 parts per hundred resin (phr).

 

Unless excessive amounts of HELOXY 61 are used, the physical properties of the cured systems are not seriously affected at room temperature. However, physical and electrical properties at elevated temperatures may be reduced considerably. Data listed in Table 1 illustrate the effect of HELOXY 61 on systems cured with various curing agents including conventional polyamines, anhydrides, and EPIKURE™ 3072 Curing Agent.

 

Figure 1 / Viscosity reduction with HELOXY Modifiers

 

 

Heloxy 61 Graph 1

Performance Properties

 

Table 1 / Typical Properties of epoxy resin systems containing HELOXY Modifier 61

 

 

Method

Units

A

B

C

D

E

Composition

 

 

 

 

 

 

 

EPON Resin 828

 

pbw

100

90

80

90

90

HELOXY 61 Modifier

 

pbw

10

20

10

10

EPIKURE 3234

 

pbw

12.9

13.3

13.6

––

EPIKURE 3072 Curing Agent

 

pbw

–––

–––

–––

36

80

Hexahydrophthalic Anhydride

 

pbw

100

90

80

––

0.5

Diethylaminoethanol

 

pbw

10

20

90

90

 

 

 

 

 

 

 

 

Handling Properties at 25°C

 

 

 

 

 

 

 

Viscosity, Resin Portion

 

cP

13,250

970

215

970

970

Gel time, 100g @ 23 °C

 

min.

44

52

72

49

¼ in. thick, @ 93 °C

 

min.

80

Peak Exotherm, 100g @ 23 °C

 

°C

223

213

222

166

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

103

75

53

59

106

Tensile strength, Ultimate

ASTM D638

psi

10,050

10,100

6,500

9,000

12,600

Tensile elongation at Break

 

%

3.7

5.6

7.4

6.4

7.4

Tensile Modulus, Initial

 

ksi

450

480

480

430

480

Flexural Strength, Ultimate

ASTM D790

psi

18,700

18,700

14,300

13,400

20,400

Flexural Modulus, Initial

 

ksi

470

490

440

400

480

Compressive Strength, Ultimate

ASTM D695

psi

33,400

31,300

32,600

27,900

50,800

Compressive Yield Strength

 

psi

15,650

13,600

11,800

12,800

16,100

Izod Impact – notch

ASTM D256

ft.•lb./inch

0.45

0.62

0.63

0.52

0.45

Weight Loss, 24 hrs. @ 150 °C

 

%

0.24

0.65

1.83

0.91

0.20

 

 

 

 

 

 

 

 

Percent Absorbtion 2

 

 

 

 

 

 

 

Water

 

%

 

 

 

 

 

24 hrs.

 

 

0.16

0.11

0.18

0.24

0.09

1 week

 

 

0.38

0.35

0.64

0.64

0.26

5% Acetic Acid

 

%

 

 

 

 

 

24 hrs.

 

 

0.21

0.53

1.68

1.28

0.09

1 week

 

 

0.58

1.48

4.7

3.35

0.25

Solvent 3

 

%

 

 

 

 

 

24 hrs.

 

 

0.02

-0.09

0.07

5.80

0.01

1 week

 

 

0.05

-0.19

0.69

0.07

Dielectric Constant 4

ASTM D150

 

3.91

4.07

4.08

3.82

3.53

Dissipation Factor 4

 

 

0.031

0.029

0.028

0.017

0.012

Volume Resistivity,

 

ohm•cm

 

 

 

 

 

at 25 °C

 

 

2.3(1015)

2.8(1014)

at 66 °C

 

 

6.1(1013)

209(1013)

 

 

at 93 °C

 

 

2.4(1012)

2.8(1011)

at 130 °C

 

 

3.6(109)

<109

 

 

 

 

 

 

 

 

 

1Determined on 0.125 thick specimens at 23 °C. Systems A through C cured 16 hours at 25 °C plus 2 hours at 100 °C. System D cured 14 days at 25 °C. System E cured 2 hours at 93 °C plus 2 hours at 200 °C.

2Weight gain of 3 inch x 2 inch x 0.125 inch specimens totally immersed in reagent at 25 °C.

350:50 by weight mix of isopropanol and xylene.

4Determined at 106 hertz.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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