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Technical Data Sheet

 

Re-issued September 2007

 

HELOXY™ Modifier 48

 

Product Description

HELOXY™ Modifier 48 is a low viscosity aliphatic triglycidyl ether useful in the viscosity, reactivity, and performance modification of epoxy resin systems.

 

Application Areas/Suggested Uses

  • Fast setting adhesives
  • Low temperature curing floor surfacing and concrete patching compounds
  • Hard, abrasion resistant clear castings and decoupage systems

 

Benefits

  • Reduces viscosity but retains reactivity of conventional and polyfunctional epoxy resins
  • Imparts hardness and toughness to epoxy systems cured with low functionality curing agents
  • Improves solubility/compatibility characteristics of highly aromatic epoxy resins without reducing functionality

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

138-154

ASTM D1652

Viscosity at 25°C

cP

120-180

ASTM D445

Color

Gardner

2

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

9.55-9.70

ASTM D1475

 

 

 

 

 


General Information

HELOXY Modifier 48 is compatible with all types of epoxy resins and serves to reduce viscosity while preserving reactivity and physical strength. Figure 1 plots the viscosity reduction efficiency of HELOXY Modifier 48. Data listed in Table 1 reflect the effect on reactivity, mechanical, electrical and chemical resistance properties and modifications with this resin.

 

HELOXY Modifier 48 is an effective modifier for liquid polyfunctional epoxy resins, as viscosity is reduced with a minimal reduction in resin functionality.

 

In blends with basic liquid epoxy resin, HELOXY Modifier 48 improves the toughness of formulations utilizing low functionality curing agents such as EPIKURE™ Curing Agents 3270 and 3274 by providing a higher cross-link density.

 

HELOXY Modifier 48 may be used with all classes of curing agents, including aliphatic amines, mercaptans, polysulfides, aromatic amines, and anhydrides. As previously mentioned, this triepoxide is particularly useful in epoxy resin systems cured with low functionality curing agents such as EPIKURE 3270 and EPIKURE 3274.

 

Figure 1 / Viscosity reduction with HELOXY Modifiers

 

 

Heloxy 48 Graph 1

Performance Properties

 

Table 1 / Typical Properties of epoxy resin systems modified with HELOXY Modifier 48

 

 

Method

Units

A

B

C

D

Composition (parts by wt)

 

 

 

 

 

 

EPON™ Resin 828

 

pbw

100

60

60

60

HELOXY Modifer 48

 

pbw

---

40

40

40

EPIKURE Curing Agent 3072

 

pbw

35

38

---

38

EPIKURE Curing Agent 3071

 

pbw

---

---

19

---

 

 

 

 

 

 

 

Handling Properties at 25°C

 

 

 

 

 

 

Viscosity, Resin Portion

 

cP

10,000

1,420

1,420

1,420

Viscosity, Total System

 

cP

4,000

1,070

---

1,070

Gel time, 100 gram mass @ 25°C

 

minutes

40

45

10

45

Peak Exotherm, 100 gram mass

 

°C

157

168

Decomposed

168

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

75

62

89

56

Tensile strength

ASTM D638

psi

9,900

8,200

10,900

8,300

Tensile elongation at Break

 

%

6.5

12

4.8

10

Flexural Strength

ASTM D790

psi

15,300

13,300

18,700

---

Initial Flexural Modulus

 

ksi

450

420

550

410

Ultimate Compressive Strength

 

psi

34,100

32,700

---

16,000

Compressive Yield Strength

 

psi

13,000

11,100

---

11,100

Izod Impact – notch

ASTM D256

ft.•lb./inch

0.44

0.60

0.56

0.59

Hardness

ASTM D2240

Shore D

88

84

87

82

 

 

 

 

 

 

 

Chemical Resistance 2

 

 

 

 

 

 

Distilled Water

 

%

0.16

0.33

0.21

0.43

5% Acetic Acid

 

%

0.29

1.58

0.81

1.99

Solvent 3

 

%

0.06

0.53

0.55

---

Weight Loss 4

 

%

0.19

0.24

0.50

0.35

 

 

 

 

 

 

 

Electrical Properties

 

 

 

 

 

 

Dielectric Constant 5

ASTM D150

 

3.76

3.79

4.23

3.80

Dissipation Factor 5

 

 

0.024

0.025

0.037

0.024

Volume Resistivity, at 25 °C

 

ohm•cm

1.6 (1016)

4.9 (1015)

8.1 (1014)

3.7 (1015)

1 Determined on 1/8” thick specimens tested at 25 °C. Systems A, B and C were cured for 16 hours at 25 °C followed by 2 hours at 93 °C.

System D was cured for 2 weeks at 25 °C.

2 Percent weight gain after immersion for 24 hours at 25 °C.

3 50 percent Xylene/50 percent Isopropanol.

4 Percent weight loss after 24 hours at 150 °C.

5 Measured at 1 Hertz and 25 °C.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

HELOXY Modifier 48 should be stored in tightly sealed containers, in a dry location at normal room temperatures. As with other epoxy resins, systems containing HELOXY Modifier 48
can crystallize during storage. The tendency to do so is affected by storage conditions, composition and other factors. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/ 

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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