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Technical Data Sheet

 

Re-issued September 2007

 

 

EPI-REZ™ Resin WD-512

 

 

Product Description

EPI-REZ Resin WD-512 water dispersible resin is a liquid bisphenol A type epoxy resin that is specifically designed for convenient water dilution. Water dilution under agitation forms a fine particle dispersion of liquid epoxy resin in water. This dilution can be accomplished at all solids levels to meet the desired viscosity and handling characteristic. EPI-REZ Resin WD-512 is particularly attractive for two-package high solids water-based formulations. It can also be used in highly crosslinked onepackage baked formulations. Typical end uses include modifiers for Portland Cement, concrete, mortars, stuccos, grouts, as a binder for trowel applied floor toppings, as bond coats, base coats, membrane coatings, sealers, and in two-package adhesives.

 

 

Sales Specification

Property

Units

Value

Test Method/Standard

Epoxide Equivalent Weight

g/eq

195-210

ASTM D1652

Viscosity at 25°C

cP

Z6-Z8

ASTM D445

Color

Gardner

2

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

9.71

ASTM D1475

 

 

 

 

 

General Information

EPI-REZ Resin WD-512 is supplied as a high viscosity liquid at 100 percent weight solids as shown in the “Typical Properties” table. In general, EPI-REZ Resin WD-512 can be handled and formulated in much the same ways as conventional liquid epoxy resins, like EPON™ Resin 828.

 

In formulation of water diluted systems, EPI-REZ Resin WD-512 is usually diluted by adding the water slowly with agitation. A stable dispersion is formed within 1 to 5 minutes with agitation by hand or with a power mixer. This diluted resin can be used as a stable epoxy package or the curing agent can be added to the mix to form a one-package formulation. The surfactant in EPI-REZ Resin WD-512 is effective enough to emulsify some non-water soluble curatives.

 

As with other waterborne resin systems, formulations based on dispersed EPI-REZ Resin WD-512 exhibit extended usable application pot life. Depending on the curative used, this application pot life may not reflect performance pot life. The actual usable working life of a specific formulation should be determined in a laboratory by studying performance related properties as a function of time elapsed from mixing to application. Figure 1 illustrates the viscosity of dispersed EPI-REZ Resin WD-512 at varying solids levels. A wide range of viscosity is attainable by water reduction, and all are stable over time at room temperature.

 

Stable dispersions using fillers are also easily prepared using EPI-REZ Resin WD-512. These dispersions exhibit a high level of stability with no separation, loss of puff or creamy consistency after 1- 1/2 months at room temperature.

 

Figure 1 / Viscosity of dispersed EPI-REZ Resin WD-512 with prolonged storage

 

EPI-REZ WD-512 Figure 1

 

 

Performance Properties

 

Handling and Performance Properties

Some of the same amine curing agents can be used with EPI-REZ Resin WD-512 as with conventional liquid epoxy resins. Table 1 compares EPI-REZ Resin WD-512 and EPON Resin 828 cured with a typical amido-amine curing agent. The system was prepared without water dilution to show the negligible effect the incorporated surfactant has on cured state properties. In Table 2 the cured state properties of EPI-REZ Resin WD-512 after water dilution are shown with the same curing agent.

 

In addition, water reducible amine curing agents can also be used with EPI-REZ Resin WD-512. Table 3 outlines the handling and cured state properties of EPI-REZ Resin WD-512 and a water dispersed amine curing agent, EPIKURE Curing Agent 8535-W-50. This combination yields a mix that has no organic solvent present. This system can be air dried up to 5 mils dry film thickness or it can be used in baked systems at higher film builds.

 

Substitution of up to 20 percent of EPI-REZ Resin WD-512 with a flexibilizer or reactive diluent retains the water reducible feature in combination with amine curing agents. Flatting agents such as colloidal silica may be incorporated at levels of to 15 phr in the dispersions without building excessive thixotropy.

 

Table 1/Handling and performance properties of EPI-REZ Resin WD-512 and EPON™ Resin 828 when cured with EPIKURE™ Curing Agent 3072

 

Composition

Units

A

B

EPI-REZ Resin WD-512

 

100

EPON Resin 828

 

100

EPIKURE Curing Agent 3072

 

33

35

Cured state properties, 1/8" casting

 

398

468

Flexural modulus

ksi

12,338

14,511

Ultimate flexural strength

psi

3.5

3.3

% strain at break

 

402,600

465,500

Tensile modulus

 

7,373

7,162

Ultimate tensile strength

psi

2.1

1.8

% strain at break

 

51

52

Heat distortion temperature

ºC

398

468

Table 2 / Cured state properties of EPI-REZ Resin WD-512 after water dilution

 

Composition

Units

Value

EPI-REZ Resin WD-512

 

100

EPIKURE Curing Agent 3072

 

33

Water

 

133

 

 

 

Cured State Properties

 

 

Dry Time, Tack-free

hrs

1.0

Cotton-free

hrs

8

Dry through

 

18

 

 

 

Properties of Films @ 250 °F

 

 

Film thickness

mils

1.0

Pencil hardness

 

H

MEK double rubs

 

>100

Izod impact, direct

in/lbs

>160

Izod impact, reverse

in/lbs

>160

Table 3 / Performance of formulation of EPI-REZ Resin WD-512 with water dispersed curing agent

 

MATERIAL

Units

Pounds

Gallons

EPI-REZ Resin WD-512 waterborne resin

 

2,967

305.55

Water

 

2,967

356.16

EPIKURE Curing Agent 8535-W-50

 

2,967

338.29

Total Part A + B

 

8,901

1,000

PROPERTIES

 

 

 

Brookfield viscosity, cP, 25 ºC

 

 

 

Initial, 100 gram mass

 

10,800

 

30 minutes

 

41,800

 

60 minutes

 

118,000

 

90 minutes

 

552,000

 

180 minutes

 

Too thick to measure

 

Pot life, time to gel, 100 g mass

mins.

77

 

 

 

 

 

FILMS CAST WITH 2 MIL METERING BAR ON COLD ROLLED STEEL

Cure schedule, temperature

ºF

77

250

Cure schedule, time @ temperature

 

14 days

20 min.

Gardner dry-time

hr.

 

 

Cotton-free

 

2.5

––

Through-dry

 

5.0

0.9

Film thickness

 

0.8

2H

Pencil hardness

 

F

>100

MEK double rubs

 

>100

>160

Impact, direct

in/lb.

124

>160

Impact, reverse

 

116

5B

Adhesion, 120 sq. method

 

5B

––

Effect of chemical spottest, 96 hr.

 

 

 

10% Acetic acid

 

Fail

Fail

10% HCl

 

Fail

5F

10% NaOH

 

NE

NE


Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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