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Technical Data Sheet

 

Product Name: Bakelite® Resin PF0436SW03

 

Description: Liquid phenolic resole resin

 

Application: PF0436SW03 is used in wet grinding bonded abrasive applications

  

Typical Properties:  

   

 

Target Value 

Höppler viscosity at 20°C

2400 – 2800 mPa·s

Gel time at 130°C

13 – 16 min

Solids content at 135°C

78 – 80%

Water tolerance

100 - 180%

 

Tests are made in accordance with the current Hexion Standard Test Method and are available upon request.

 

Packaging: Drum, tote, tank car

 

Storage: PF0436SW03 should be useable for 6 weeks when stored at 18-20°C.

 

Handling: This product has to be used and disposed of according to the indications given in its safety data sheet.

 

Note: As part of our quality assurance efforts, we ensure compliance with the indicated product parameters at the time of shipping.  Phenolic resins are known to be subject to a process of change that depends on the storage and transportation conditions. Even when the material is stored at the conditions indicated above, the useful life must be individually verified by the user of our products.

   

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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