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Technical Data Sheet

 

Re-issued August 2001

 

 

EPIKURE™ Curing Agent 3251

 

 

Product Description

EPIKURE™ Curing Agent 3251 is a phenol-free, modified Mannich base epoxy curing agent. It provides fast setting, low-temperature curing (40-50 °F), chemically resistant, high solids sprayable coatings with good corrosion resistance similar to conventional polyamides. When properly formulated, good adhesive, synthetic flooring and potting properties are observed.

 

Application Areas/Suggested Uses

  • High solids and solvent free coatings
  • Potting, casting and encapsulation
  • Structural adhesives
  • Chemical resistant tank linings
  • Accelerator or co-curing agent for polyamides
  • Synthetic flooring
 

 

Benefits

  • Low temperature cure
  • Light color
  • Low viscosity
  • Excellent moisture resistance
  • High gloss, carbonate free surfaces
  • Contains no free phenol

 

Sales Specification

Property

Units

Value

Test Method/Standard

Amine value

g/eq

350 - 390

ASTM D2896

Viscosity at 25°C

cP

400 - 700

ASTM D2196

Color

Gardner

5 max.

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Equivalent weight, approx.

 

76

 

Pounds/gallon @ 25 °C

lbs/gal

8.3

ASTM D1475

Flash Point

°F

282

ASTM D3278

Mix ratio, with EPON™ Resin 828

pbw

40

 

Appearance

 

Clear and free of foreign particles

 

 

 

 

 

 

General Information

 

Performance Properties

 

Table 1 / Typical clear coating formulation and performance data

 

 

Method

Units

A

EPON™ Resin 828

 

pbw

100

EPIKURE Curing Agent 3251

 

pbw

40

 

 

 

 

Handling Properties @ 25°C

 

 

 

Solids

 

%

100

Viscosity

 

Gardner

Z

Pot Life, 250 gram mass

 

minutes

14

 

 

 

 

Cure Schedule

 

days/°C

7/25

 

 

 

 

Cured State Properties 2

 

 

 

Impact, forward/reverse

 

in.•lbs

40/40

Dry Film Thickness

 

mils

2.5

Pencil Hardness

 

 

H

Gloss, 85°

 

%

95

MEK Double Rubs

 

 

50

 

 

 

 

Chemical Spot Test, 7 days

 

 

 

Deionized Water

 

 

No effect

5% Aceric Acid

 

 

No effect

10% NaOH

 

 

No effect

10% HCI

 

 

No effect

10% H2SO4

 

 

No effect

10% HNO3

 

 

No effect

MEK

 

 

Blister

50%/50%  IPA/Xylene

 

 

Swelling

 

 

 

 

QUV 1500 Hours

 

 

 

Gloss

 

 

55

Yellowing

 

 

Heavy

Chalk

 

 

Slight

 

 

 

 

Salt Fog, 1500 Hours

 

 

 

Creep

 

 

Slight

Blistering

 

 

None

Stain

 

 

None

Adhesion

 

 

Pass

 

 

 

 

 

Table 2 / Typical casting formulation and performance data

 

 

Method

Units

A

EPON Resin 828

 

pbw

100

EPIKURE Curing Agent 3251

 

pbw

40

 

 

 

 

Handling Properties @ 25°C

 

 

 

Solids

 

%

100

Viscosity

 

Gardner

Z

Pot Life, 250 gram mass

 

minutes

14

Peak Exotherm

 

°C

221

Time to Peak Exotherm

 

minutes

24

 

 

 

 

Cure Schedule

 

days/°C

7/25

 

 

 

 

Cured State Properties 2

 

 

 

Heat Deflection Temperature

ASTM D648

°C

78

Tensile Strength

ASTM D638

psi

9,000

Tensile Elongation at break

 

%

2.1

Tensile Modulus

 

ksi

---

Flexural Strength

ASTM D790

psi

16,300

Flexural Modulus

 

ksi

500

Compressive Strength

ASTM D695

psi

16,200

Hardness

 

Shore D

84

 

 

 

 

Chemical Resistance 1

ASTM D543

 

 

Deionized Water absortion

 

%

0.8

5% Acetic Acid

 

%

1.0

10% HCI

 

%

0.7

10% H2SO4

 

%

0.8

50% Xylene/50% Isopropanol

 

%

Destroyed

10% HNO3

 

%

0.9

10% NaOH

 

%

0.6

 

 

 

 

Electrical Properties

 

 

 

Dielectric constant

ASTM D150

 

 

120 Hz

 

 

2.74

1 KHz

 

 

2.68

Dissipation factor

ASTM D150

 

 

120 Hz

 

 

0.002

1 KHz

 

 

0.004

Volume resistivity

 

ohm•cm

5 x 1015

 

 

 

 

1 Percent weight gained after 40 hours immersion

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

Product will absorb moisture and carbon dioxide which may affect viscosity or create foamingwhen reacted with epoxy resins.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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