Print Version (PDF) [ close ]   

Technical Data Sheet

 

Re-issued August 2001

 

 

EPIKURE™ Curing Agent 3277

 

 

Product Description

EPIKURE™ Curing Agent 3277 is a moderately reactive curing agent for epoxy resins. It is low in viscosity, water insensitive, and resists “blushing” and “sweat-out” even under high humidity conditions.

 

Application Areas/Suggested Uses

  • Damp surfaces
 

 

Benefits

  • Systems designed for underwater application and/or cure
  • Waterborne epoxy resin formulations
  • Solventless high-build coatings
  • Wet lay-up laminating compounds
  • Glaze coat and binder for sand-filled, trowel-applied floor toppings
  • High solids coatings

 

Sales Specification

Property

Units

Value

Test Method/Standard

Amine as KOH

mg/g

280 – 313

ASTM D2896

Color

Gardner

5 max.

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Equivalent weight, approx.

 

92

 

Viscosity at 25°C

cP

275

 

Pounds/gallon @ 25 °C

lbs/gal

8.01

 

 

 

 

 

 

General Information

Even under high humidity conditions, systems containing EPIKURE Curing Agent 3277 have good resistance to sweat-out, no overnight tack, and have good adhesion to a variety of substrates, including damp and submerged substrates.

 

EPIKURE Curing Agent 3277 is compatible in all proportions with liquid epoxy resins and does not require an induction period to produce glossy surfaces which are free from amine carbonate salts. The curing agent, when combined with an epoxy resin, gives fast cure development with good solvent resistance. Due to the difference in viscosities between this curing agent and most liquid epoxy resins, it may take longer than usual to achieve thorough blending. A mixing period of 3 minutes is usually adequate to ensure a homogeneous solution of resin and curing agent.

 

The handling characteristics and cured state properties of the compositions presented in Tables 1 and 2 illustrate the versatility of EPIKURE 3277 systems. While monoepoxide diluent modification of resins used in conjunction with EPIKURE Curing Agent 3277 is an effective means of formulating low viscosity, flexible thermosetting systems, care should be taken in selecting the concentration of modifier to be employed.

 

As seen in Table 1 data, excessive amounts of monoepoxide diluent result in significant reductions in crosslink density, causing reduced heat distortion temperature and solvent resistance.

 

Polyepoxide diluents, such as HELOXY™ Modifier 505 and HELOXY Modifier 48, are effective viscosity reducers which impart some flexibility and which have a minimal effect on other cured state properties (Table 1).

 

Flow control agents such as urea-formaldehyde resin, colloidal silica, SR-82 silicone resin1, Modaflow2 or various thixotropes should be incorporated into high-build coatings to ensure good film continuity.

 

EPIKURE Curing Agent 3277 can be blended with EPI-REZ™ Resin WD-510 to produce a water  dispersible mixture for applications where the use of conventional diluents is not feasible (Table 2).

 

Cure rate is proportional to application thickness and temperature. For 7 mil films, EPON™ Resin 828/EPIKURE Curing Agent 3277 systems cure tack-free in approximately 9 hours at 23 °C. Monoepoxide diluent modifications generally extend the working life and prolong the necessary cure period. Polyepoxide diluents, such as HELOXY Modifier 48, maintain or decrease cure time. Flexibilizers, such as HELOXY Modifier 505, will extend cure time (Table 1).

 

If increased reactivity is desired, EPIKURE Curing Agent 3270 or EPIKURE Curing Agent 3271 can be blended with EPIKURE Curing Agent 3277 (Tables 1 and 2).

 

1 Supplied by General Electric Company.

2 Supplied by Monsanto Company.

 


 

Performance Properties

 

Table 1 / Properties of Diluent-Containing Resin Systems Cured with EPIKURE Curing Agent 3277

 

 

Method

Units

A

B

C

D

E

F

EPON™ Resin 828

 

pbw

100

88

90

85

85

88

HELOXY™ Modifier 62

 

pbw

---

12

---

---

---

12

HELOXY Modifier 8

 

pbw

---

---

10

---

---

---

HELOXY Modifier 48

 

pbw

---

---

---

15

---

---

HELOXY Modifier 505

 

pbw

---

---

---

---

15

---

EPIKURE Curing Agent 3277

 

pbw

49

49

47

50

43.9

36.8

EPIKURE Curing Agent 3271

 

pbw

---

---

---

---

---

4.1

 

 

 

 

 

 

 

 

 

Handling Properties @ 23°C

 

 

 

 

 

 

 

 

Viscosity, Initial

 

cP

2,300

1,150

1,000

1,600

1,790

875

Gel Time, 100 gram mass

 

minutes

47

60

65

42

58

41

Peak Exotherm at 23°C, 100 grams

 

°C

301

293

246

303

224

355

 

 

°F

149

145

119

151

107

179

 

 

 

 

 

 

 

 

 

Cure Schedule

 

wk/°C

2/23

2/23

2/23

2/23

2/23

2/23

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

59

48

49

55

46

58

Tensile Strength

ASTM D638

psi

8,700

6,400

5,500

6,900

5,400

8,300

Tensile Elongation

 

%

2.4

25

40

45

22

2.3

Tensile Modulus

 

ksi

470

470

260

340

290

400

Flexural Strength

ASTM D790

psi

15,500

11,000

9,400

12,100

8,300

13,700

Flexural Modulus

 

ksi

490

400

320

390

250

460

Flexural Deflection

 

inches

0.24

>0.6

>0.6

>0.6

>0.6

0.18

Compressive Strength Ultimate

 

psi

14,200

16,500

18,000

15,800

21,200

15,400

Compressive Strength Yield

 

psi

13,800

11,800

9,700

12,200

7,200

15,400

Izod impact, notched

ASTM D256

ft.•lb./in.

0.34

0.42

0.44

0.42

0.44

0.41

Hardness

 

Shore D

87

85

83

87

83

88

 

 

 

 

 

 

 

 

 

Chemical Resistance 2

 

 

 

 

 

 

 

 

Water

 

%

0.13

0.08

0.10

0.17

0.18

0.10

5% Acetic Acid

 

%

0.44

0.29

0.38

0.83

0.48

0.27

Xylene

 

%

1.43

6.06

4.68

2.51

4.25

1.04

 

 

 

 

 

 

 

 

 

1 Determined on 1/8” thick test specimens cured two weeks at 23 °C.

2 Reported as percent weight gain after immersion for 24 hours at 23 °C.

 

Table 2 / Properties of Epoxy Resin Systems Cured with EPIKURE Curing Agent 3277

 

 

Method

Units

A

B

C

D

EPON Resin 828

 

pbw

100

---

100

100

EPI-REZ™ Resin WD-510

 

pbw

---

100

---

---

EPIKURE Curing Agent 3277

 

pbw

49

46

28.1

29.7

EPIKURE Curing Agent 3271

 

pbw

---

---

7.0

---

EPIKURE Curing Agent 3270

 

pbw

---

---

---

29.7

 

 

 

 

 

 

 

Handling Properties @ 23°C

 

 

 

 

 

 

Viscosity, Initial

 

cP

2,300

2,800

2,300

3,400

Gel Time, 100 gram mass

 

minutes

47

47

23

18

Peak Exotherm at 23°C, 100 grams

 

°C

301

305

369

336

 

 

°F

149

152

187

169

 

 

 

 

 

 

 

Cure Schedule

 

wk/°C

2/23

2/23

2/23

2/23

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

59

60

62

67

Tensile Strength

ASTM D638

psi

8,700

7,200

9,400

9,400

Tensile Elongation

 

%

2.4

4.3

1.7

2.8

Tensile Modulus

 

ksi

470

350

550

470

Flexural Strength

ASTM D790

psi

15,500

10,500

15,900

15,700

Flexural Modulus

 

ksi

490

310

560

430

Flexural Deflection

 

inches

0.24

>0.6

0.15

0.23

Compressive Strength Ultimate

 

psi

14,200

---

14,600

11,600

Compressive Strength Yield

 

psi

13,800

---

14,600

11,600

Izod impact, notched

ASTM D256

ft.•lb./in.

0.34

0.46

0.38

0.39

Hardness

 

Shore D

87

85

88

87

 

 

 

 

 

 

 

Chemical Resistance 2

 

 

 

 

 

 

Water

 

%

0.13

0.23

0.11

0.12

5% Acetic Acid

 

%

0.44

0.62

0.40

0.54

Xylene

 

%

1.43

2.86

0.32

0.49

 

 

 

 

 

 

 

1 Determined on 1/8” thick test specimens cured two weeks at 23 °C.

2 Reported as percent weight gain after immersion for 24 hours at 23 °C.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

EPIKURE Curing Agent 3277 should be stored in tightly sealed containers of metal, glass, or polyolefin plastic at normal room temperature. The curing agent may darken during long-term storage, the extent of color formation depending on storage temperature and exposure to air.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

Print Version (PDF) [ close ]