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Technical Data Sheet

 

Re-issued August 2001

 

 

EPIKURE™ Curing Agent 3282

 

 

Product Description

EPIKURE™ Curing Agent 3282, a very reactive modified aliphatic amine adduct, has been developed for applications where relatively short cure periods at room temperature are required.

 

Application Areas/Suggested Uses

  • Tooling gel coats
  • Laminating compounds
  • Adhesives
 

 

 

Sales Specification

Property

Units

Value

Test Method/Standard

Amine as KOH

mg/g

761-809

ASTM D2896

Viscosity at 25°C

cP

2,900-4,900

ASTM D2196

Color

Gardner

6

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Equivalent weight, approx.

 

38

 

Pounds/gallon @ 25 °C

lbs/gal

8.92

ASTM D1475

Flash Point

°F

>200

Setaflash

 

 

 

 

 

 

General Information

Compositions based on EPON™ Resin 828 and EPIKURE Curing Agent 3282 cure readily at room temperature. The pot life of such compositions is highly dependent on the volume of the mixture, temperature, amount and type of filler loading, and, to a lesser extent, the presence of a reactive diluent. An indication of the reactivity of several unfilled systems under varying conditions is presented in Table 1.

 

EPIKURE Curing Agent 3282 is normally used at a weight ratio of 20 parts per 100 parts of liquid epoxy resin. Thin sections, where exothermic heat is readily dissipated, require 4 to 8 hours for the composition to cure to handling strength. The composition reaches full cure after 4 to 7 days. Thin sections may be cured rapidly at moderately elevated temperatures, but thick sections should be allowed to exotherm before heat is applied. The maximum thickness recommended for an unfilled composition is approximately 1/2 inch. Maximum high temperature properties are obtained with a post cure of about 2 hours at 93 to 121 °C.

 

Performance Properties

 

Table 1 / Reactivity of compositions containing EPIKURE™ Curing Agent 3282

 

 

Units

A

B

C

EPON™ Resin 828

pbw

100

---

80

EPON Resin 815

pbw

---

100

---

HELOXY™ Modifier 61

pbw

---

---

20

EPIKURE Curing Agent 3282

pbw

20

20

20

 

 

 

 

 

 

Handling Properties @ 25°C

 

 

 

 

 

 

 

Weight,

 

Thickness,

Gel Time,

Maximum Exotherm,

Gel Time,

Maximum Exotherm,

Gel Time,

Maximum Exotherm,

grams

inch

min.

°F

°C

min.

°F

°C

min.

°F

°C

100

2

15

400

204

16

385

196

17

375

191

50

1

16

350

177

18

315

157

24

300

149

25

1

19

320

160

22

270

132

31

225

107

10

3/16

90

93

34

120

77*

25*

150

77*

25*

 

 

 

 

 

 

 

 

 

 

 

                       

* No exothermic temperature rise.

 

A comparison of the properties of three formulations cured with EPIKURE Curing Agent 3282 is presented in Table 2. With the exception of heat deflection temperature, the properties of post-cured formulations are only slightly better than those cured at room temperature. The major effect of the reactive diluent in the low viscosity systems is on the elevated temperature physical properties of the cured formulations.

 

Table 2 / Properties of Systems Cured with EPIKURE Curing Agent 3282

 

 

Method

Units

A

B

C

D

E

F

EPON Resin 828

 

pbw

100

100

---

---

80

80

EPON Resin 815

 

pbw

---

---

100

100

---

---

HELOXY Modifier 61

 

pbw

---

---

---

---

20

20

EPIKURE Curing Agent 3282

 

pbw

20

20

20

20

20

20

 

 

 

 

 

 

 

 

 

Handling Properties @ 25°C

 

 

 

 

 

 

 

 

Viscosity, Initial

 

cP

10,000

10,000

800

800

450

450

Gel Time, 100 gram mass

 

minutes

15

15

16

16

17

17

 

 

 

 

 

 

 

 

 

Cure Schedule

 

hrs/°C

16/25

2/100

 

16/25

2/100

 

16/25

2/100

 

 

 

wk/°C

 

3/25

 

3/25

 

3/25

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

99

60

73

50

50

46

Tensile Strength

ASTM D638

psi

11,000

10,000

10,500

9,500

9,500

9,000

Tensile Elongation at break

 

%

3.8

0.8

6.8

3.8

10.0

6.0

Flexural Strength

ASTM D790

psi

19,900

18,500

19,400

18,000

15,700

15,300

Flexural Modulus

 

ksi

550

580

520

550

490

510

Compressive Strength, yield

 

psi

16,100

14,500

14,500

13,500

13,250

12,500

Izod impact, notched

ASTM D256

ft.•lb./in.

0.46

0.36

0.44

0.34

0.41

0.32

Hardness

 

Shore D

90

89

89

87

88

86

Weight loss 2

 

%

0.10

0.18

0.72

0.68

1.57

1.68

 

 

 

 

 

 

 

 

 

Chemical Resistance

 

 

 

 

 

 

 

 

Water absortion 3

 

%

0.10

0.10

0.15

0.15

0.20

0.19

 

 

 

 

 

 

 

 

 

Electrical Properties

 

 

 

 

 

 

 

 

Dielectric constant 4

ASTM D150

 

4.19

---

4.20

---

4.20

---

Dissipation factor 4

 

 

0.026

---

0.024

---

0.023

---

Volume resistivity

 

 

 

 

 

 

 

 

at 25 °C

 

ohm•cm

2.8x1016

---

1.5x1016

---

6.1x1015

---

at 66 °C

 

ohm•cm

1.0x1015

---

4.2x1013

---

2.2x1011

---

at 93 °C

 

ohm•cm

8.0x1012

---

1.8x1011

---

6.1x109

---

at 130 °C

 

ohm•cm

6.0x1010

---

<109

---

<109

---

 

 

 

 

 

 

 

 

 

1 Determined on 1/8-inch thick test specimens at 25 °C. Systems A,C and E were cured for 16 hours at 25 °C followed by a post cure of 2 hours at 100 °C. Systems B,D and F were cured for 3 weeks at 25 °C.

2 Percent weight loss after 24 hours at 150 °C.

3 Percent weight gain after 24 hours immersion at 25 °C.

4 Determined at 106 Hertz.

 


Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

EPIKURE Curing Agent 3282 should be stored in tightly sealed, completely filled containers of metal, glass, or polyolefin plastic at normal room temperatures. The curing agent may darken during long-term storage, the extent of color formation depending on storage temperature and exposure to air.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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