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Technical Data Sheet

 

Re-issued September 2001

 

 

EPON™ Resin SU-2.5

 

 

Product Description

EPON™ Resin SU-2.5 is one of a family of epoxy resins based on a high aromatic content, polyfunctional structure. The principal difference between resins within the EPON Resin SU series is functionality and viscosity. EPON SU-2.5 offers the lowest viscosity and easiest working characteristics while contributing a higher functionality than is available from the standard bisphenol-based liquid EPON Resin 828.

 

Application Areas/Suggested Uses

  • Wet lay-up and prepreg laminating
  • Adhesives
  • Casting, “gunk” molding, and tooling applications
 

 

Benefits

  • Low viscosity
  • High functionality

 

Sales Specification

Property

Units

Value

Test Method/Standard

Epoxide Equivalent Weight

g/eq

180 – 200

ASTM D1652

Viscosity at 52°C

P

20 – 60

ASTM D2196

Color 1

Gardner

6 max.

ASTM D1544

 

 

 

 

1 Reduced to 60 percent nonvolatiles in 2-(2-butoxyethoxy) ethanol.

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density at 25°C

lb/gal

9.8

ASTM D1475

Flash Point

°C

>93

ASTM D93

 

 

 

 

 

 

General Information

EPON Resin SU-2.5 is compatible with conventional bisphenol-based epoxy resins as well as most specialty epoxy resins. Due to its high functionality, the resin is a useful base resin for imparting chemical resistance, high service temperature performance and rigidity to cured systems. As a modifying resin it contributes these features to more conventional epoxy systems. Table 1 profiles the cured state properties of the resin.

 

At normal room temperature this resin is a pourable liquid with a viscosity of approximately 25,000 centipoise. Several options that are available for attaining a more suitable working consistency include heating the resin (see Figure 1 for a plot of viscosity versus temperature), or using reactive diluents, low viscosity curing agents, or solvents in applications where this can be tolerated. Monoepoxides drastically decrease the average functionality of the resin systems and thus defeat the primary purpose of the polyfunctional resin. When using reactive diluents, it is preferable to use a higher functionality reactive diluent such as HELOXY™ 48 Modifier.

 

All curing agents commonly used to cure epoxy resins can be used to cure EPON Resin SU-2.5. For application of the system at elevated temperatures, relatively long pot life curing agents such as anhydrides are useful. Other curing agent choices, depending upon the intended application and performance requirements, include aliphatic amines, dicyandiamide, and boron trifluoride complexes.

 

Figure 1 / Viscosity vs. Temperature

 

EPON Resin SU-2.5 Figure 1

 

 

Performance Properties

 

Table 1 / Properties of High Functionality Epoxy Resin Systems

 

 

Method

Units

A

B

C

D

E

F

EPON Resin SU-2.5

 

pbw

100

100

100

---

---

---

EPON Resin SU-3

 

pbw

---

---

---

100

100

100

Methyl Endomethylene

Tetrahydrophthalic Anhydride

 

pbw

 

82

 

---

 

---

 

81

 

---

 

---

Methyl Tetrahydrophthalic Anhydride

 

pbw

---

83

---

---

81

---

Aromatic Amine, eutectic blend

 

pbw

---

---

22.5

---

---

22

2-Ethyl-4-Methyl Imidazole

 

pbw

0.3

---

---

0.3

---

---

Diethyl Ethanol Amine

 

pbw

---

0.5

---

---

0.5

---

 

 

 

 

 

 

 

 

 

Handling Properties @ 93°C

 

 

 

 

 

 

 

 

Gel Time, 1/8” thickness

 

minutes

140

72

36

120

60

21

 

 

 

 

 

 

 

 

 

Cure Schedule

 

hr/°C

3/93

6/175

2/120

4/175

2/93

2/200

3/93

6/175

2/120

4/175

2/93

2/200

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

171

120

169

179

128

179

 

 

°C

214

---

---

225

---

---

Tensile Strength

ASTM D638

psi

7,600

12,200

9,500

6,600

10,100

5,700

Tensile Elongation

 

%

1.5

3.8

2.9

1.2

2.2

1.3

Flexural Strength

ASTM D790

psi

15,000

23,000

16,000

18,600

22,000

14,000

Flexural Modulus, Initial

 

ksi

500

580

520

510

590

550

Compressive Strength, Yield

 

psi

---

19,000

20,000

---

19,000

21,000

 

 

 

 

 

 

 

 

 

1 Determined on 1/8( thick test specimens at 25 °C. Systems A and D were cured for 3 hours at 93 °C followed by 6 hours at 175 °C. Systems B and E were cured for 2 hours at 120 °C followed by 4 hours at 175 °C. Systems C and F were cured for 2 hours at 93 °C followed by 2 hours at 200 °C.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

EPON Resin SU-2.5 should be stored in tightly sealed metal or polyolefin plastic containers at normal room temperature.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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