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Technical Data Sheet

 

Re-issued September 2001

 

 

EPON™ Resin SU-8 (a.k.a. EPIKOTE™ 157)

 

 

Product Description

EPON™ Resin SU-8 is a polymeric solid epoxy novolac resin possessing an average epoxide group functionality around eight. EPON SU-8 is compatible with bisphenol A-based epoxy resins, imparting improved high temperature strength, thermal stability, reactivity and chemical resistance. Prepreg laminates and graphite or boron reinforced composites with EPON SU-8 attain the maximum strength retention and thermal stability possible for an epoxy matrix system at elevated temperatures. Epoxy molding powders prepared with EPON SU-8 are characterized by an outstanding combination of flow stability and short press cycles.

 

Application Areas/Suggested Uses

  • Prepreg
  • Electrical laminating
  • Adhesives
 

 

Benefits

  • Long shelf life
  • Micropulverized at ambient temperatures
  • Rapid development of hot hardness
  • Maximum elevated temperature strength retention
  • Improved tack qualities and lateral cohesiveness of unidirectional tapes

 

Sales Specification

Property

Units

Value

Test Method/Standard

Epoxide Equivalent Weight

g/eq

195 – 230

ASTM D1652

Viscosity at 130°C

P

10 – 60

ASTM D2196

Color 1

Gardner

6 max.

ASTM D1544

 

 

 

 

1 40% weight in Butyl Carbitol

 

Typical Properties

Property

Units

Value

Test Method/Standard

Melting Point

°C

82

ASTM D3104

Density at 25°C

lb/gal

10.0

ASTM D1475

Flash Point

°F

>200

ASTM D93

 

 

 

 

 

 

General Information

EPON Resin SU-8 can be used as a modifier for upgrading the elevated temperature properties and the reactivity of bisphenol A epoxy resin systems for molding powders or powder coatings. The high molecular weight of EPON SU-8 improves the tack qualities and lateral cohesiveness of unidirectional fiber reinforced tapes prepared with many epoxy matrix systems.

 

For prepreg applications, EPON SU-8 can be dissolved in numerous solvents such as most ketones, toluene, and diacetone alcohol.

 

Suggested formulations are available illustrating the use of EPON SU-8 in transfer and compression molding powders, high temperature adhesives, NEMA G-11 and FR-5 circuit boards of both conventional thickness and MLC types, advanced engineering composites, and other high temperature reinforced plastics applications such as those requiring MILRS-9300A, Type ll properties.

 

EPON SU-8 may be processed and cured with a variety of epoxy resin curing agents. Table 1 lists a number of curing agents for several different types of applications.

 

Table 2 and Figure 1 profile the excellent performance of EPON SU-8 relative to other commercially available high functionality resins.

 

Figure 1 / Thermal stability of glass laminates1 prepared with high functionalitysolidepoxy resin/anhydride/catalyst/EMI-24 binder systems

 

EPON Resin SU-8 Figure 1

1 12-ply laminates prepared with 181 Style glass cloth (I-550 finish). All binder systems consist of the designated epoxy resin cured with methylendomethylene tetrahydrophthalic anhydride at 90 percent stoichiometric level and accelerated with 2-ethyl-4-methyl imidazole at 0.22 phr concentration. Laminates were press-cured 1 hour at 150 °C, then post-cured 16 hours at 200 °C prior to initiating aging test in forced-air ovens.

 

Table 1 / Curingagents for several applications

 

Molding Powders

Reinforced Plastics

Powder Coatings

Phenolics

Phenolics

Phenolics

Dicyandiamide

Dicyandiamide

Dicyandiamide

Phthalic anhydride

Methyl endomethylene

Trimellitic anhydride

Tetrachlorophthalic anhydride

Tetrahydrophthalic anhydride

Melamine

4,4’-Methylenedianiline

BF3MEA 1

 

 

Imidazoles

 

 

4,4’-Diaminodiphenyl sulfone

 

1 BF3MEA is boron triflouride monoethylamine

 

 

Performance Properties

 

Table 2 / Contribution of various high functionality solid epoxy resins to properties of aphenolic cured molding powder compound

 

 

Method

Units

A

B

 

 

 

 

 

EPON Resin SU-8

82°C melting point

 

pbw

100

---

o-Cresol-Formaldehyde

Novolac type, 80 °C melting point

 

pbw

---

100

Phenolic Curing Agent

 

pbw

52

48

Pigment

 

pbw

5

5

Candelilla wax

 

pbw

3

3

325-Mesh silica filter

 

pbw

250

240

Spiral Flow,1 inches

 

pbw

31

42

 

 

 

 

 

Cured State Properties 1

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

192

175

Tg by DSC

ASTM 3418

°C

194

158

Tensile Strength

ASTM D638

psi

7,400

7,200

Tensile Elongation

 

%

---

---

Flexural Strength

ASTM D790

psi

15,000

14,000

Flexural Modulus

 

ksi

---

---

Compressive Strength, Yield

 

psi

26,000

27,000

Hardness

 

Shore D

92

84

Linear Shrinkage

 

inch/inch

0.0068

0.0070

 

 

 

 

 

Electrical Properties

 

 

 

 

Dielectric constant, 1 MHz

ASTM D150

 

5.07

5.13

Dissipation factor, 1 MHz

 

 

0.0070

0.0068

 

 

 

 

 

1 Determined at 1,000 psi and 150 °C per EMMI 1-66.

2 Determined on bars molded from dielectrically heated preforms in a transfer press at 1,000 psi and 150 °C for 3 minutes.

3 Determined immediately upon ejection from 150 °C mold.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

This product is prone to "blocking" or "sintering", i.e., softening of the particles and agglomeration to a semi-solid mass, when stored at slightly elevated temperatures. Blocking does not affect the performance of the resin. This product should be stored in a cool dry place to minimize handling problems due to blocking.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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