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Technical Data Sheet

 

Re-issued September 2001

 

 

EPON™ Resin 8021

 

 

Product Description

EPON™ Resin 8021 is a very low viscosity resin possessing excellent wetting characteristics and rapid reaction rates with aliphatic amine curing agents over a broad temperature range. This combination of properties makes EPON 8021 an excellent choice for use in adhesives for bonding difficult-to-wet substrates, low temperature applied flooring compounds, rapid setting sealing compounds, and pressure injection systems.

 

Aliphatic amine cured EPON 8021 compositions are characterized by tough flexible cures reflecting a good combination of mechanical properties.

 

As a modifier for basic liquid epoxy resins, EPON 8021 imparts to the composition a unique combination of reduced viscosity, fast cure, and flexibility.

 

The excellent wetting characteristics of this resin are readily apparent when applied in bondline thicknesses to metal, plastic, damp concrete, and other difficult-to-wet substances. This property is manifest in exceptionally high bond strength to many such materials.

 

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

300 – 320

ASTM D1652

Viscosity at 25°C

cP

85 – 115

ASTM D445

Color

Gardner

1 max.

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density at 25°C

lb/gal

9.2

ASTM D1475

Combining Equivalent Weight

 

150

 

 

 

 

 

 

 

Processing/How to use

 

General Information

EPON 8021 is a highly reactive multifunctional resin containing both epoxide groups and reactive unsaturation. Unlike conventional epoxy resins, polymerization can occur with moderate heating. The temperature of EPON 8021 should not exceed 50 °C during storage, mixing or grinding operations.

 

The use of typical epoxy diluents or alkaline fillers with EPON 8021 Epoxy Resin may also result in polymerization. Therefore, it is important that any modifier be carefully screened prior to commercial use with EPON 8021.

 

Equivalent weight based on reaction with amine-active hydrogen 150. The extremely low viscosity of EPON 8021permits higher filler loadings, eliminates the need for reactive diluents, and provides for suitable working characteristics at lower application temperatures than conventional epoxy resins. Figure 1 plots the viscosity of this resin at various temperatures.

 

Figure 1/ Resin viscosity at various temperatures

EPON 8021 Figure 1

 

 

EPON 8021 was designed to be cured with aliphatic amines. Suitable curing agents for use with this resin include EPI-CURE™ 3282 and 3271 Curing Agents as well as the unmodified polyethylene amines, such as triethylenetetramine. For optimum property development, the preferred combining ratio is calculated on the basis of one amine-active hydrogen equivalent per 150 parts by weight EPON 8021.

 

Polyamide curing agents, amidoamine curing agents, aromatic amine curing agents, mercaptans, and anhydrides can also be used to cure EPON 8021. However, generally soft, low strength thermosets are obtained when using these types of curing agents. Catalytic curing agents such as boron trifluoride complexes, dicyandiamide, and tertiary amines are not recommended for use with EPON 8021.

 

When cast in thin films, systems based on EPON Resin 8021/aliphatic amine curing agent combinations form smooth, continuous coatings free of cratering, crawling and residual surface tackiness. Such systems are less prone to form “sweat-out” when applied in thin film than are similar systems based on conventional bisphenol A based epoxy resins. Epoxy compounds based on EPON 8021 possess unusually low exotherm temperatures for their reactivity class. This combination of high reactivity and moderate exotherm suggests the use of this resin in splicing and sealing compounds.

 

Performance Properties

The cured state properties obtained from aliphatic amine cured EPON 8021 alone and in combination with various levels of EPON Resin 828 are listed in Table 1.

 

 

Table 1/ Cured State Properties of EPON™ Resin 8021 Systems

 

 

Method

Units

A

B

C

D

E

F

EPON™ Resin 8021

 

pbw

100

75

50

25

60

60

EPON Resin 828

 

pbw

---

25

50

75

40

40

EPIKURE™ Curing Agent 3234

 

pbw

16.0

15.2

14.3

13.5

---

---

EPIKURE Curing Agent 3295

 

pbw

---

---

---

---

29

---

EPIKURE Curing Agent 3271

 

pbw

---

---

---

---

---

17

 

 

 

 

 

 

 

 

 

Handling Properties

 

 

 

 

 

 

 

 

Resin Viscosity at 25°C

 

cP

100

220

610

2,000

450

450

Gel Time at 25°C, 100 grams

 

min.

13

14

17

23

16

5.5

Peak Exotherm at 25°C, 100 grams

 

°C

73

---

182

---

154

194

 

 

 

 

 

 

 

 

 

Cure Schedule

 

wks/°C

2/25

2/25

2/25

2/25

2/25

2/25

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

45

54

55

58

60

60

Tensile Strength

ASTM D638

psi

6,200

8,900

10,200

11,100

9,200

10,200

Tensile Elongation at break

 

%

21

4.4

4.2

4.2

4.6

4.0

Flexural Strength

ASTM D790

psi

9,000

14,000

16,700

17,000

14,000

15,000

Flexural Modulus, Initial

 

ksi

0.29

0.43

0.50

0.54

0.48

0.50

Compressive Strength, ultimate

 

ksi

30

24

21

18

16

26

Compressive Strength, yield

 

ksi

8.4

11.3

13

14.5

10.6

12.9

Izod Impact, notch

ASTM D256

ft.•Ib./inch

0.59

0.94

1.05

1.03

0.28

0.57

Hardness

 

Shore D

80

82

84

84

82

84

 

 

 

 

 

 

 

 

 

Chemical Resistance 2

 

 

 

 

 

 

 

 

Distilled Water

 

%

0.29

0.22

0.16

0.15

0.22

0.19

5% Acetic Acid

 

%

2.31

1.60

0.94

0.92

1.41

0.37

5% NaOH

 

%

0.28

0.20

0.16

0.15

0.21

0.18

Solvent 3

 

%

1.55

1.00

0.18

0.17

0.53

0.43

 

 

 

 

 

 

 

 

 

Weight Loss 4

 

%

2.68

1.76

1.11

0.58

1.93

2.04

 

 

 

 

 

 

 

 

 

Electrical Properties

 

 

 

 

 

 

 

 

Dielectric Constant 5

ASTM D150

 

3.98

4.02

4.10

4.12

4.08

4.21

Dissipation Factor 5

 

 

0.033

0.029

0.027

0.023

0.029

0.026

Volume Resistivity

 

ohm•cm

4.6 x 1015

1.2 x 1016

1.9 x 1016

1.6 x 1016

2.7 x 1016

6.2 x 1016

 

 

 

 

 

 

 

 

 

1 Castings were cured for 2 weeks at 25 °C.

2 Percent weight gain after immersion for 24 hours at 25 °C.

3 50 percent xylene/50 percent isopropanol.

4 Percent weight loss after 24 hours at 50 °C.

5 Determined at 100 Hertz and 25 °C.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

EPON Resin 8021 should be stored in tightly sealed glass, stainless steel or phenolic-lined containers at normal room temperatures. Storage in unlined steel containers should be avoided. Care should be taken to avoid storage temperatures above 50 °C. EPON 8021 should not be stored below 0 °C, since this will result in acute resin crystallization. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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