Print Version (PDF) [ close ]   

Technical Data Sheet

 

Re-issued September 2001

 

 

EPON™ Resin 8111

 

 

Product Description

EPON™ Resin 8111 is a low viscosity resin displaying exceptionally rapid reaction rates with aliphatic amine curing agents over a broad temperature range while providing performance levels roughly equivalent to basic liquid epoxy resins. This unique feature suggests the use of EPON Resin 8111 in rapid set adhesives and patching compounds capable of satisfactory use at application temperatures to 0 °C.

 

Aliphatic amine cured EPON Resin 8111 systems are characterized by hard, tough cures exhibiting mechanical, electrical, and water resistance properties similar to those normally expected from conventional liquid epoxy resins.

 

Good wetting characteristics, strong bonding to various substrates, and a reduced tendency to form amine carbonate in thin film applications suggest the use of EPON Resin 8111 in various high build coating applications such as two-component spray applied traffic striping, wear resistant surfacing and clear sealers.

 

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

300 - 320

ASTM D1652

Viscosity at 25°C

cP

800 – 1,100

ASTM D445

Color

Gardner

1 max.

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density at 25°C

lb/gal

9.52

ASTM D1475

Equivalent weight 1

 

140

 

 

 

 

 

1 Based on reaction with active amine hydrogen.

 

 

Processing/How to use

 

General Information

EPON Resin 8111 is a highly reactive multifunctional resin containing both epoxide groups and reactive unsaturation. Unlike conventional epoxy resins, polymerization can occur under certain conditions. The temperature of EPON Resin 8111 should not exceed 50 °C during storage, mixing or grinding operations.

 

The use of typical epoxy diluents or alkaline fillers with EPON Resin 8111 may also result in polymerization. Therefore, it is important that any modifier be carefully screened prior to commercial use with EPON Resin 8111.

 

For applications requiring further viscosity reductions and/or flexibility, the addition of EPON Resin 8021 is suggested. EPON Resin 828 is also compatible with EPON Resin 8111.

 

The viscosity of EPON Resin 8111 is lower than that of unmodified bisphenol A liquid resins. (Because of its low viscosity, reactive diluents are not necessary for most applications.)

 

This low viscosity combined with high reactivity makes EPON Resin 8111 suitable for use in many low temperature applications. Figure 1 plots the viscosity of this resin at various temperatures.

 

Figure 1/ Resin viscosity at various temperatures

EPON 8111 Figure 1

 

 

EPON Resin 8111 was designed to be cured with aliphatic amines. Within this curing agent class, EPI-CURE* Curing Agent 3295, EPI-CURE Curing Agent 3271, and unmodified polyethylene amines such as triethylene tetramine are particularly useful converters for this resin due to their low viscosity and moderate to high reactivity. EPI-CURE Curing Agent 3282, while higher in viscosity, is also recommended for this use. When using these curing agents, the preferred combining ratio is calculated on the basis of one active hydrogen equivalent weight per one hundred forty parts by weight EPON Resin 8111.

 

When cast in thin films, systems based on EPON Resin 8111/aliphatic amine curing combinations form smooth, continuous coatings free of cratering, crawling or residual surface tackiness. Such systems are less prone to “sweat-out” when applied in thin films than are similar systems based on conventional bisphenol A based epoxy resins.

 

Epoxy compounds based on EPON Resin 8111 possess unusually low exotherm temperatures in comparison to conventional epoxy systems of similar reactivity. This combination of high reactivity and moderate exotherm suggests the use of this resin in splicing and sealing compounds.

 

 

Performance Properties

The cured state properties resulting from triethylene tetramine cures of EPON Resin 8111 alone, and in combination with various levels of EPON Resin 828, are listed in Table I.


 

Table 1 / Properties of Epoxy Systems Containing EPON™ Resin 8111

 

 

Method

Units

A

B

C

D

E

F

G

EPON Resin 8111

 

pbw

100

75

50

25

---

100

---

EPON Resin 8021

 

pbw

---

---

---

---

25

---

---

EPON Resin 828

 

pbw

---

25

50

75

75

---

100

EPIKURE Curing Agent 3234 1

 

pbw

17

16

15

14

13.5

17

12

 

 

 

 

 

 

 

 

 

 

Handling Properties @ 25°C

 

 

 

 

 

 

 

 

 

Resin Viscosity

 

cP

900

1,490

2,640

5,270

2,000

900

12,000

Gel Time, 100 gram mass

 

minutes

2.5

3

4.5

13

23

2.5

31

Peak Exotherm at 25°C, 100 grams

 

°C

188

---

196

---

---

188

229

 

 

 

 

 

 

 

 

 

 

Cure Schedule

 

wk/°C

2/25

2/25

2/25

2/25

2/25

16hrs/25 + 2hrs/100

16hrs/25 + 2hrs/100

 

 

 

 

 

 

 

 

 

 

Cured State Properties 2

 

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

56

57

59

59

58

79

101

Tensile Strength

ASTM D638

psi

10,000

10,400

10,600

11,000

11,100

8,900

12,500

Tensile Elongation at break

 

%

3.4

3.1

2.5

2.5

4.2

4.2

5.3

Flexural Strength

ASTM D790

psi

15,600

16,700

17,400

17,900

17,000

15,000

20,000

Flexural Modulus, Initial

 

ksi

500

530

560

560

540

410

510

Compressive Strength, Ultimate

 

psi

18,000

14,000

14,900

15,100

18,000

29,000

35,000

Compressive Strength, Yield

 

psi

13,000

14,000

14,900

15,100

14,500

11,000

16,000

Izod impact, notched

ASTM D256

ft.•lb./in.

0.46

0.40

0.37

0.38

1.03

0.69

0.51

Hardness

 

Shore D

85

85

85

85

84

86

87

Linear Shrinkage

 

inch/inch

---

---

0.021

---

---

---

---

Weight loss 3

 

%

0.38

0.34

0.33

0.30

0.58

0.21

0.16

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chemical Resistance 4

 

 

 

 

 

 

 

 

 

Distalled Water

 

%

0.15

0.14

0.14

0.14

0.15

0.17

0.15

5% acetic acid

 

%

1.31

1.26

1.31

1.38

0.92

0.57

0.19

5% NaOH

 

%

0.15

0.14

0.14

0.14

0.15

0.16

0.15

50% xylene/50% isopropanol

 

%

0.04

0.02

0.07

---

0.17

0.01

0.02

 

 

 

 

 

 

 

 

 

 

Weight loss 4

 

%

0.38

0.34

0.33

0.30

0.58

0.21

0.16

 

 

 

 

 

 

 

 

 

 

Electrical Properties

 

 

 

 

 

 

 

 

 

Dielectric constant, 100 Hz 5

ASTM D150

 

3.97

4.01

4.06

4.13

4.12

3.80

4.08

Dissipation factor, 100 Hz 5

 

 

0.025

0.023

0.022

0.022

0.023

0.029

0.026

Volume resistivity at 25 °C

 

ohm•cm

2.4x1016

2.5x1016

2.7x1016

3.0x1016

1.6x1016

1.8x1016

1.8x1016

 

 

 

 

 

 

 

 

 

 

1 Use of EPON Resin 8111 with aliphatic polyamines, which include such products as amidoamine, amine adducts and polyamides.

2 Determined on 1/8-inch thick test specimens tested at 25 °C. Systems A through E were cured for 2 weeks at 25 °C. Systems F and G were cured for 16 hours at 25 °C followed by 2 hours

at 100 °C.

3 Percent weight loss after 24 hours at 150 °C.

4 Percent weight gain after 24 hour immersion at 25 °C.

5 Determined at 100 Hertz at 25 °C.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

EPON Resin 8111 should be stored in tightly sealed glass, stainless steel or phenolic line containers at normal room temperatures. Storage in unlined steel containers should be avoided. Care should be taken to avoid storage of this resin above 50 °C.

 

Prolonged storage of EPON Resin 8111 at temperatures below -10 °C can result in resin crystallization. Should this occur, gentle warming to normal ambient temperatures will restore this resin to its original homogeneous state.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

Print Version (PDF) [ close ]