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Technical Data Sheet

 

Re-issued January 2008

 

 

EPI-REZ™ Resin WD-510

 

 

Product Description

EPI-REZ™ Resin WD-510 is a liquid, bisphenol A type epoxy resin specifically designed for water dilution. In combination with epoxy curing agents and dilution with water it forms resin in water emulsions. It is useful as a modifier for Portland Cement, concrete, mortars, stuccos, and grouts. As a binder it is useful for trowel applied floor toppings, bond coats, base coats, membranecoatings and sealers.

 

 

Suggested Uses

EPI-REZ WD-510 forms uniform dispersions in water in combination with Aliphatic amine curing agents, including adducts, amidoamines, polyamides, and accelerated amines. To make these dispersions the EPI-REZ WD-510 and curing agent must first be thoroughly blended. Then water is added to the blend and stirred in, either manually or with an agitator powered by a motor. Resin/curing agent blends are diluted with water to a solids level of 40 to 80 percent by weight. This dispersion process is typically facilitated with glycol ether cosolvents and epoxy viscosity reducing modifiers. While batches of the water dispersed system exhibit long dispersion life (generally remain emulsified through gelation), the usable working life of some formulations is shorter than the dispersion life. The actual usable working life of a specific formulation should be determined in a laboratory by studying performance related properties as a function of time elapsed from mixing to application. EPI-REZ WD-510 can also be combined with ECO-CRYL™ Acrylic Resin Dispersion 9790 to produce two-package water reducible coatings. EPI-REZ WD-510 may be used in place of EPON Resin 828 for lower VOC's in combination with waterborne EPIKURE™ Epoxy Curing Agents for 2 package epoxy industrial finishes.

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

190 - 205

ASTM D-1652

Viscosity

cP

8,000 - 12,000

ASTM D-2196

Color

Gardner

2

ASTM D-1259

 

 

 

 

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Pounds/Gallon

lbs/gal

9.64

 

 

 

 

 

 

 

Processing/How to use

 

General Information

EPI-REZ Resin WD-510 can be thinned with epoxy diluent modifiers including HELOXY™ Modifier 8, HELOXY Modifier 62 or CARDURA™ E-10 to facilitate mixing and handling. Ethylene glycol monopropyl ether may be used to lower viscosity of the resins during the water dispersing process. EPI-REZ Resin WD-510 does not contain alkylphenol ethoxylates.

 

Table 1 outlines the handling characteristics of water reducible systems incorporating EPI-REZ WD-510 with various amine curing agents. Substitution of up to 20 percent of EPI-REZ WD-510 with a flexibilizer or reactive diluent retains the water reducible feature in combination with amine curing agents. Flatting agents such as colloidal silica may be incorporated at levels up to 15 parts per hundred resin in the emulsions without building excessive thixotropy.

 

Cured state properties of EPI-REZ WD-510 amine systems are very similar to those of corresponding EPON™ Resin 828 compositions. Table 2 compares such systems prior to water reduction of the EPI-REZ WD-510 system.

 

Table 1/ Handling Characteristics and Film Properties of Water-Thinned Epoxy Systems

 

Composition

Value

A

B

C

D

EPI-REZ Resin WD-510

 

100

100

100

100

EPIKURE™ Curing Agent 3274

 

38

EPIKURE Curing Agent 3046

 

48

EPIKURE Curing Agent 3270

 

72

EPIKURE Curing Agent 3072

 

33

Water

 

53

57

67

53

Colloidal Silica1

 

1

2

1

1

Blend Properties at 25 °C2

 

 

 

 

 

Gel Time, 100 g mass

hrs

9

8

 

0.5

 

5

 

Emulsion Life

 

 

 

 

 

Solids

%

72

 

72

 

72

 

72

 

Film Properties3

 

 

 

 

 

Tack-Free Time

hrs

16

24

8

11

Film Continuity

 

Good

Craters

Good

Good

Clarity

 

Transparent

Cloudy

Cloudy

Cloudy

"Sweat-out"

 

None

Slight

None

Slight

 

1 Cab-O Sil M-5 supplied Cabot Corporation.

2 Emulsions prepared by first blending the resins, converter and colloidal silica, then adding water and agitating for 2 minutes using a portable electric drill and "Jiffy" agitator.

3 5 mil wet films applied with doctor blade at 25 °C

 


Table 2/ Comparison of Cured State Properties of Undiluted EPI-REZ™ Resin WD-510 versus EPON Resin 828

 

Composition

Value

A

B

C

D

EPI-REZ WD-510 Resin

 

100

100

EPON Resin 828

 

100

100

EPIKURE Curing Agent 3274

 

38

40

EPIKURE Curing Agent 3072

 

33

35

 

 

 

 

 

 

Cured State Properties1

 

 

 

 

 

Ultimate Tensile Strength

psi

8,400

9,200

9,400

7,000

Tensile Elongation

%

3

4

4

1.6

Ultimate Flexural Strength

psi

12,900

14,500

15,000

Flexural Modulus

106 psi

0.41

0.46

0.52

Compressive Yield Strength

psi

13,000

12,600

13,200

Izod Impact

ft.•lb./in. notch

0.49

0.53

0.52

0.45

Hardness

Shore D

85

83

85

88

 

 

 

 

 

 

Chemical Resistance2

 

 

 

 

 

Distilled Water

 

0.38

0.21

0.20

0.10

5% Acetic Acid

 

0.59

0.25

0.81

50:50 Xylene/lsopropanol

 

11.6

8

1.25

 

1 All test specimens were cured for 2 weeks at 25 °C.

2 Percent weight gain after immersion for 24 hours at 25 °C.


 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

For ease of handling and optimum shelf life, epoxy dispersions should be stored in tightly sealed containers at temperatures between 50 °F (10 °C) and 100 °F (37.8 °C). Do not allow the product to freeze. To prevent skinning or surface drying, do not leave the product uncovered for extended periods of time. If the need arises to store partially filled drums, replace the plastic top-sheet onto the surface of the liquid product.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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