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Ultra High Molecular Weight Resin for Flexibility, Flow and Adhesion

EPONOL™ ultra high molecular weight resin from Hexion is used primarily in:

  • Paints--improves flexibility for reduced chipping and cracking
  • Coatings--improves adhesion to polar substrates and improves flexibility
  • Prepreg laminate varnishes--improves flow control during thermal curing
  • Adhesives--improves adhesion and flexibility
  • Composites--improves flow and flexibility
  • Polymers, as a plastic additive--promotes blending of incompatible polymers

Ultra-High Molecular Weight Resins (Phenoxy-type)

ProductTypical PropertiesDescriptionApplication
Resin TypeViscocity @25oC, cPSolvents(2)CoatingsConstructionCompositesAll Others(1)
EPONOL Resin 53-BH-35BPA Phenoxy Resin600 – 3600MEK / PM Ultra high-molecular-weight epoxy resin. Imparts flexibility and to adjust flow properties of the system.
 
 
RECOMMENDED:
 
HIGHLY RECOMMENDED:
 

1 Other applications include adhesives, electrical castings, electrical laminates and fibers

2 MEK – methyl ethyl ketone; H – Propylene glycol monomethyl ether


For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.