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Solid Epoxy Resins

EPON™ Resin 1000 series resins are solid epoxy resins made via fusion with bisphenol A and are generally used in composites, baked industrial coatings, and the preparation of epoxy ester resins.

Medium to higher molecular weight grades are available, as well as both basic and sinter-resistant grades.

These solid resins can also be combined with other resins to impart unique melt viscosity characteristics to hot melt adhesives, molding powders, and powder coatings.

EPON solid epoxy resins provide end-products with:

  • High performance
  • High flexibility
  • Good abrasion resistance
  • Good corrosion resistance

ProductTypical PropertiesDescriptionApplication
WPE, g./eq.Viscocity at 25oC, cPMelt Point, oCCoatingsConstructionCompositesAll Others(2)
EPON Resin 1001F525 - 5507.0 - 9.679Lowest molecular weight solid epoxy resin. Susceptible to sintering.
 
 
 
EPON Resin 1002F600 - 700 9.2 - 13.685Slightly higher molecular weight than EPON Resin 1001F. Improved sintering resistance.
 
 
 
EPON Resin 1004F800 - 95015 - 2596Medium molecular weight solid epoxy resin.
 
 
 
EPON Resin 1007F1700 - 220050 - 100125Moderately high molecular weight solid epoxy resin primarily for industrial coatings.
 
 
EPON Resin 1009F2300 - 3800100 - 250135High molecular weight primarily for baked coatings.
 
 
RECOMMENDED:
 
HIGHLY RECOMMENDED:
 

1 40% wt. solution in methyl ethyl ketone
2 Other applications include adhesives, electrical castings, electrical laminates and fibers


For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.