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Epoxy Systems for Adhesives and Bonding Applications

Hexion has decades of experience designing systems of epoxy resins, curing agents and modifiers to meet the requirements for a variety of adhesive applications. We offer specialized resin systems expertise, with a range of options that can be used as starting points for developing higher value products for your customers in the following areas:

    Systems for Adhesives & Bonding

    SystemStarting Formulation PropertiesAdhesive Type
    Starting Formula No.Formula Mix Ratio1Gel -Time (Minutes)Metal BondingRapid Setting and Lower TemperatureConcrete Bonding and RepairConcrete Bonding and Repair
    EPON™ Resin 8021 / EPIKURE™ Curing Agent 327140028 : 117
     
     
     
    EPON Resin 8111 / EPIKURE Curing Agent 3270 / EK327140011.1 : 14
     
     
     
     
    EPON Resin 828 / E58034 EPIKURE Curing Agent 307240182.7 : 145
     
    EPON Resin 828 / E58034 Latent curing agent (e.g. Dicy)40231-packheat cure
     
    EPI-REZ™ Resin WD-510 / EPIKURE Curing Agent 307240061 : 1300
     
    EPON Resin 828 / HELOXY™ Modifier 8 EPIKURE Curing Agent 306140161 : 1240
     
    EPON Resin 828 / HELOXY™ 61 EPIKURE Curing Agent 312540141 : 2180
     
    EPON Resin 8132 / EPIKURE Curing Agent 316440091 : 2180
     
    RECOMMENDED:
     
    HIGHLY RECOMMENDED:
     
    (1) Mix ratio of the Formulation by Volume (Part A component to Part B component)
    A more comprehensive list of civil engineering starting formulations is available in this Product Selector Guide.