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EPON™ Resin 1031-A-70

Description

EPON™ Resin 1031-A-70 is a multifunctional epoxy resin supplied in solution. This resin is used to improve the properties of cured epoxy resin systems particularly at elevated temperatures. It finds application in electrical laminates, high performance composites and adhesives. EPON Resin 1031-A-70 features an average of greater than three reactive groups per molecule, low ionic contaminants, and low saponifiable chloride levels. The use of EPON Resin 1031-A-70 in epoxy resin formulations increases the crosslink density of cured systems. This raises the glass transition temperature. At elevated temperatures such systems have greater strength and rigidity and show improved retention of electrical properties and resistance to attack by moisture. In addition, EPON Resin 1031-A-70 imparts fluorescence and UV blocking properties to laminates.

Application

EPON Resin 1031-A-70 is commonly included in formulations to make laminates for the support of both low and high density electrical circuits. Properly made formulations using this resin are capable of meeting the demanding dimensional stability, and automated optical inspection requirements of multilayer printed circuit boards. Addition of EPON Resin 1031-A-70 helps prevent solder mask “print through” for all circuit boards. The low level of ionic impurities in this resin contributes to high electrical resistance. The low saponifiable chloride content helps to shorten cure time with selected curing agents, thus improving handling characteristics and speed of production of the laminates.

In the multilayer laminate industry, EPON Resin 1031-A-70 can be used at a level of 5 to 30% weight solids added to brominated resin laminating varnishes. Laminates prepared from prepregs with this level of EPON Resin 1031-A-70 modification possess many of the same properties as conventional FR-4 boards but with a substantial increase in thermal resistance. Glass transition temperatures (DSC) in the range of 150 to 160 °C can be achieved at the 30% weight solids level. No special handling of prepreg by fabricators is necessary as prepreg pressing conditions are the same as with conventional FR-4 systems.

EPON Resin 1031-A-70 has a lower viscosity than EPON Resin 1031-B-80 and is used where acetone can be tolerated in the laminating process for ease of handling and varnish blending.

EPON Resin 1031-A-70 is also used in structural composites and adhesives. High performance products are made for aircraft and aerospace use where cured resin systems are used for metal-to-metal bonding and structural components. The strong adhesive properties of epoxies as well as the retention of other physical properties at higher temperatures are particularly important in these end uses.

Benefits

  • Low viscosity

Sales Specification

Property Standard Value Unit Test Method
Epoxide Equivalent Weight 195 - 230 g/eq ASTM D1652
Solids 69 - 71 % ASTM D1259
Viscosity at 25°C A – I Gardner ASTM D1545

Typical Properties

Property Standard Value Unit Test Method
Density at 25°C 9.1 lb/gal ASTM D1475
Saponifiable Chloride 0.08 % wt.
Solvent              Acetone