Duration: 42 ms, Number of Results: 246

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Epikote Resin MGS BPR20 and Epikure Curing Agent MGS BPH20

Bonding Paste - is used in these applications: secondary bonding of FRP to FRP and various materials; production of rotor blades for wind energy plants and shipbilding; and sporting goods, moulds, tools and other devices.

Product

EPIKOTE Resin 828LVEL

Viscosity range intermediate between EPIKOTE 827 and EPIKOTE 828EL. Performance similar to EPIKOTE 828EL. Low hydrolysable chlorine content, designed for applications in the electrical and electonics industries. Also suitable for advancement to solid resins. Disclaimer: ® and ™ Licensed t

Product

EPIKOTE™ Resin 828LVEL

Viscosity range intermediate between EPIKOTE 827 and EPIKOTE 828EL. Performance similar to EPIKOTE 828EL. Low hydrolysable chlorine content, designed for applications in the electrical and electonics industries. Also suitable for advancement to solid resins.

Product

EPIKURE Curing Agent 3140A

A low viscosity reactive polyamide, high imidazoline, moderate molecular weight epoxy curing agent based on dimerized fatty acid and polyamines Low viscosity for this class of curatives. Applications include adhesives and extending pot life of highly reactive amines. Disclaimer: ® and ™ L

Product

EPIKURE Curing Agent 3125A

Medium viscosity highly reactive polyamide epoxy curing agent. A general purpose curing agent for epoxy resins that is suitable for many uses. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at th

Product

EPIKOTE Resin 816

EPIKOTE 816 is a low viscosity epoxy resin produced from bisphenol A and epichlorohydrin, and containing an added proportion of Cardura E10P as a reactive diluent. EPIKOTE 816 is considered to have a moderate resistance to crystallisation on storage. EPIKOTE 816 has good handling properties, good pi

Product

EPON Resin 233

EPON™ Resin 233 is a low viscosity resin based on a mixture of Bisphenol-F and Bisphenol-A epoxy resin. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared

Product

EPIKOTE™ Resin 04695-1 and EPIKURE™ Curing Agent 05490A and HELOXY™ Additive 112

Epoxy resin system designed for conventional and gap-RTM applications and provides excellent wetting and adhesion characteristics on glass, carbon- or aramid-fibers. The benefits of this system are: low viscosity, short curing cycle and outstanding Class-A surface quality.

Product

EPIKOTE™ Resin MGS™ RIMR135 and EPIKURE™ Curing Agent MGS™ RIMH134, RIMH1366, RIMH137, RIMH138

Rotor blades for wind energy turbines, boat and shipbuilding, sports and recreation equipment, tooling and other devices. Pot life from approx. 0,5h to 7h, good mechanical and fatigue properties.

Product

EPI-REZ Resin 3515-W-60

Waterborne dispersion of a semi-solid Bisphenol A epoxy resin.

Product

EPIKOTE Resin 836-C-75, 836-X-80

Semi-solid resin at room temperature, supplied in an MIBK and a xylene solution. Principally used as co-resin in other film formers and contributes to level film performance with good flexibility.

Product

EPIKOTE Resin 828XA

Medium viscous epoxy resin produced from bisphenol A and epichlorohydrin. EPIKOTE 828XA has a good resistance to crystallisation on storage. It provides good pigment wetting and resistance to filler settling. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided

Product

Durite Resin SD-241A

Durite Resin SD-241A is a high purity ortho-cresol formaldehyde novolac resin is used in epoxy intermediates and PCB assembly applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the t

Product

Durite Resin D_PD-1630

Durite Resin D_PD-1630 is a medium molecular weight, high purity cresol formaldehyde novolac resin used in semiconductor applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time o

Product

Durite Resin D_PD-427A

Durite Resin D_PD-427A is a high purity cresol formaldehyde resin used in semiconductor photoresist applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prep

Product

Durite Resin SD-1817

Durite Resin SD-1817 is a high purity triazine novolac used in epoxy curing and PCB assembly applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared fr

Product

Durite Resin SC-1008

Durite Resin SC-1008 is a liquid phenolic resole resin approved for the production of military and aerospace grade glass laminates in composite applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be

Product

Durite Resin PD-0744LB 01

Durite Resin PD-0744LB 01 is a fast-dissolving, high purity cresol formaldehyde novolac resin suitable for printing plate applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time

Product

Epikote Resin MGS LR418 and Epikure Curing Agent MGS LH418

Production of gliders, motor gliders, motor planes and helicopters, boat- and shipbuilding, sport equipment, model airplanes, automotive parts, moulds and tools for high temperatures. High heat resistance, excellent mechanical properties and low water absorption.

Product

Durite Resin PD-494A

Durite Resin PD-494A is a slow-dissolving high purity cresol formaldehyde novolac resin used in printing plate applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparat

Product

Durite Resin PD-0744LB

Durite Resin PD-0744LB is a slow-dissolving, high purity cresol formaldehyde novolac resin used in printing plate applications Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of prepar

Product

Durite Resin D_PD-126A

Durite Resin D_PD-126A is a low molecular weight, high purity cresol formaldehyde novolac resin used in semiconductor photoresist applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at t

Product

Bakelite Resin FD-2170

Bakelite Resin FD-2170 is a powdered phenolic novolac resin with hexamethylenetetramine, suitable for general purpose bonding and various friction applications. Application: FD-2170 is a general purpose bonding resin for a variety of friction applications. Description: Powdered phenolic novolac wi

Product

EPIKURE Curing Agent 530

Light color and low viscosity modified cycloaliphatic amine curing agent. This curing agent contains no Nonylphenol. Longer pot life than EPIKURE Curing Agent 541. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion )

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