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High purity cresol formaldehyde novolac resin
D_PD-1623 is a low molecular weight resin used in semiconductor photoresist applications
Property | Standard | Value | Unit | Test Method |
---|---|---|---|---|
Appearance | Crushed solid | |||
Average Molecular Weight GPC | ca. 4500 – 5500 | g/mol | ||
Bulk Dissolution Rate 2.38% TMAH Developer, PAB 110°C/60 seconds | ca. 95 - 195 | Å/sec | ||
Free Cresol Content GC | 1 | % | ||
Individual Trace Metal Content GFAA | max 500 | ppb |
Tests are made in accordance with the current Hexion Standard Test Method and are available upon request.