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EPON™ Resin 872


EPON™ Resin 872 is a chemically modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872 can be formulated with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872 can be used with all curing agents. EPON Resin 872 provides cured resin toughness and flexibility in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. EPON Resin 872 is especially useful in applications requiring extra resistance to thermal shock or impacts.


  • May be blended with other epoxy resins.
  • Semi-solid at room temperature, pourable at mildly elevated temperatures.
  • May be used to produce potting and encapsulants of high thermal shock resistance.
  • Improved toughness and flexibility over unmodified liquid epoxies.

Sales Specification

Property Standard Value Unit Test Method
Color 10 max. Gardner ASTM D1544
Viscosity at 25°C 15 - 38 P ASTM D445
Weight per Epoxide 625 - 725 g/eq ASTM D1652

1 75% solution in xylene

Typical Properties

Property Standard Value Unit Test Method
Density at 25°C 9.0 lb/gal ASTM D1475