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Technical Data Sheet

 

Re-issued September 2007

 

HELOXY™ Modifier 116

 

Product Description

HELOXY 116 Modifier is a commercial grade of 2-ethylhexyl glycidyl ether. A low viscosity, almost colorless monoepoxide, its primary use is the viscosity reducing modification of epoxy resin formulations.

 

Benefits

  • Efficient viscosity reduction of conventional epoxy resins
  • Excellent substrate and filler wetting characteristics
  • Low volatility relative to other members of monoepoxide class

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

215-225

ASTM D1652

Viscosity at 25°C

cP

2-4

ASTM D445

Color

Gardner

1

ASTM D1544

Epichlorohydrin

mg/kg

10

SMS 2445

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

7.49-7.66

ASTM D1475

 

 

 

 

 

 

General Information

A comparison of the viscosity reduction efficiency of HELOXY Modifier 116 with other HELOXY epoxy functional modifiers is illustrated in Figure 1. Since the quantity of diluent modification required in an epoxy system is normally dictated by its viscosity reducing efficiency, a comparison of monoepoxide diluted epoxy systems of equal viscosity has shown that HELOXY Modifier 116 ranks just below butyl glycidyl ether (HELOXY Modifier 61) in retaining physical strength and thermal performance of the unmodified system.

 

HELOXY Modifier 116 possesses an odor quite different from that of other aliphatic monoepoxides, and systems modified with this diluent might be less objectionable in this regard to certain individuals.

 

Since the degree to which performance properties are affected depends on the amount of HELOXY Modifier 116 in the formulation, the amount used in the formulation should be limited to that necessary to yield the required viscosity reduction. The maximum recommended quantity of HELOXY Modifier 116 is about 20 percent of the resin portion.

 

Figure 1 / Viscosity dilution effectiveness of HELOXY Modifiers

 

Heloxy 116 Graph 1

 

Properties of Cured Systems

Curing agents that are recommended for unmodified basic liquid epoxy resins can also be used with compositions containing HELOXY Modifier 116. When calculating the proper stoichiometric amount of curing agent to be used with HELOXY Modifier 116 modified resins, differences in epoxy content of the resin resulting from this modification are small and can generally be ignored at modification levels below 10 parts per hundred resin (phr).

 

HELOXY Modifier 116 is compatible with epoxy resins in all proportions and is easily blended with liquid resins at room temperature. These blends can be cured with any of the commonly used epoxy resin curing agents. Since HELOXY Modifier 116 is a monoepoxide compound, it reduces the functionality of the system and impairs the chemical and solvent resistance of the cured resin.

 

Unless excessive amounts of HELOXY Modifier 116 are used, the physical properties of the cured systems are not seriously affected at room temperature. However, physical and electrical properties at elevated temperatures might be reduced considerably. Data listed in Table 1 illustrate the effect of HELOXY Modifier 116 on systems cured with various curing agents including conventional polyamines, anhydrides, and EPIKURE™ Curing Agent 3072.

 

Performance Properties

 

Table 1 / Typical Properties of epoxy resin systems containing HELOXY Modifier 116

 

 

Method

Units

A

B

C

D

E

F

Composition

 

 

 

 

 

 

 

 

EPON Resin 828

 

pbw

100

87

82

87

82

82

HELOXY Modifier 116

 

pbw

13

18

13

18

18

Triethylenetetramine

 

pbw

13

12

12

EPIKURE Curing Agent 3072

 

pbw

34

34

Hexahydrophthalic anhydride

 

pbw

77

Diethylaminoethanol

 

pbw

0.5

 

 

 

 

 

 

 

 

 

Handling Properties at 25°C

 

 

 

 

 

 

 

 

Viscosity, Resin Portion

 

cP

11,000

1,100

600

1,100

600

600

Gel time, 100g @ 23 °C

 

min.

28

46

53

70

85

¼ in. thick, @ 93 °C

 

min.

80

Peak Exotherm, 100g @ 23 °C

 

°C

223

209

199

159

130

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

106

76

69

66

59

90

Tensile strength, Ultimate

ASTM D638

psi

12,300

10,300

9,000

8,400

6,800

10,000

Tensile elongation at Break

 

%

4.9

5.9

8.5

77

2.2

2.8

Tensile Modulus, Initial

 

ksi

470

490

470

390

320

470

Flexural Strength, Ultimate

ASTM D790

psi

19,500

17,000

14,400

12,600

10,400

19,500

Flexural Modulus, Initial

 

ksi

480

470

420

360

310

450

Compressive Strength, Ultimate

ASTM D695

psi

42,000

33,800

34,800

21,300

23,500

31,000

Compressive Yield Strength

 

psi

16,200

13,100

11,500

11,100

9,200

15,500

Izod Impact – notch

ASTM D256

ft.•lb./in.

0.45

0.50

0.57

0.44

0.47

0.48

Weight Loss, 24 hrs. @ 150 °C

 

%

0.24

0.65

1.09

0.90

1.41

0.24

 

 

 

 

 

 

 

 

 

Percent Absorbtion 2

 

 

 

 

 

 

 

 

Water

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.16

018

018

0.20

0.26

0.10

1 week

 

 

0.38

0.45

0.50

0.57

0.73

0.25

5% Acetic Acid

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.21

0.49

0.69

0.79

1.07

0.10

1 week

 

 

0.58

1.29

1.90

2.25

2.78

0.25

Solvent 3

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.02

0.08

0.49

4.58

795

0.18

1 week

 

 

0.05

0.42

2.55

Sample Erosion

0.75

Dielectric Constant 4

ASTM D150

 

3.91

3.78

3.75

3.66

3.62

3.31

Dissipation Factor 4

 

 

0.031

0.026

0.025

0.016

0.019

0.012

Volume Resistivity

 

ohm•cm

 

 

 

 

 

 

at 25 °C

 

 

2.3(1015)

2.4(1015)

2.1(1015)

4.0(1015)

>1016

at 66 °C

 

 

6.1(1013)

1.1(1013)

2.8(1012)

2.5(1012)

4.3(1015)

at 93 °C

 

 

2.4(1012)

3.2(1011)

1.4(1010)

6.4(1010)

2.4(1015)

at 130 °C

 

 

3.6(109)

< 109

< 109

<109

1.8(1014)

1 Determined on 0.125 inch thick specimens at 23 °C. System A, System B and System C cured 16 hours at 25 °C, plus 2 hours at 100 °C. System D and System E cured 14 days at 25 °C. System F cured 2 hours at 98 °C, plus 2 hours at 200 °C.

2 Weight gain of 3 in. x 1 in. x 0.125 in. (specimens totally immersed in reagent at 25 °C).

3 50:50 by weight mix of isopropanol and xylene.

4 Determined at 106 hertz.

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

HELOXY Modifier 116 should be stored in tightly sealed containers, in a dry location at room temperature. Some epoxy materials can crystallize during storage. The tendency to do so is affected by storage conditions, composition and other factors. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/ 

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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