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Technical Data Sheet

 

Re-issued September 2007

 

HELOXY™ Modifier 8

 

Product Description

Introduction HELOXY Modifier 8 is an aliphatic monoglycidyl ether containing alkyl chains which are predominately C12 and C14 in length. Its primary use is the viscosity reducing modification of epoxy resin formulations.

 

Benefits

  • Efficient viscosity reduction of conventional epoxy resins
  • Excellent substrate and filler wetting characteristics
  • Non-offensive odor
  • Low level of volatility

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

280-295

ASTM D1652

Viscosity at 25°C

cP

6-9

ASTM D445

Color

Pt-Co

50

ASTM D1209

Epichlorohydrin

mg/kg

10

SMS 2445

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

7.4-7.6

ASTM D1475

 

 

 

 

 

 

General Information

HELOXY Modifier 8 is commonly used as a viscosity reducing modifier of conventional liquid, bisphenol A based epoxy resin. Its high diluting efficiency, mild odor, low color and broad compatibility characteristics make it a particularly useful modifier in the formulation of resinous floor toppings, casting compounds, water reducible coatings, adhesives, and electrical encapsulation systems.

 

A comparison of the viscosity reduction efficiency of HELOXY 8 with other HELOXY modifiers is illustrated in Figure 1. Since the quantity of diluent modification required in an epoxy system is normally dictated by its viscosity reducing efficiency, a comparison of monoepoxide diluted epoxy systems of equal viscosity has shown that effects on physical strength and thermal performance resulting from modification with HELOXY 8 approach those of butyl glycidyl ether (HELOXY 61) based counterparts in retaining performance of the unmodified system.

 

The relative toxicity of HELOXY 8 is lower than that of butyl glycidyl ether (HELOXY 61) and, therefore, its use represents a lower health risk to workers handling compounds in which it is used.

 

HELOXY 8 possesses a characteristic odor which has been found to be less objectionable to most users than that of other monoepoxides.

 

As with any monoepoxide, modification of basic epoxy resins with HELOXY 8 reduces the average epoxide functionality of the mixture thereby lowering cured state chemical and solvent resistance and thermal performance. Since the degree to which these performance properties are affected depends on the amount of HELOXY 8 in the formulation, the amount used should be limited to that necessary to yield the required viscosity reduction. The maximum recommended quantity of HELOXY 8 is about 20 percent of the resin portion.

 

HELOXY 8 is compatible with epoxy resins in all proportions and is easily blended with liquid resins at room temperature. These blends can be cured with any of the curing agents commonly recommended for use with unmodified epoxy resin systems. When calculating the proper stoichiometric amount of curing agent to be used with HELOXY 8 modified resins, differences in epoxy content of the resin resulting from this modification are small and can generally be ignored at modification levels below 10 parts per hundred resin (phr). Unless excessive amounts of HELOXY 8 are used, the physical properties of the cured systems are not seriously affected at room temperature. However, physical and electrical properties at elevated temperatures may be reduced considerably. Data listed in Table 1 illustrate the effect of HELOXY 8 on systems cured with various curing agents including conventional polyamines, anhydrides, and EPIKURE 3072 Curing Agent.

 

Pre-blends of HELOXY 8 and a standard bisphenol A based epoxy resin are available as EPON Resin 8132. Each is supplied at a viscosity selected for ease of handling and application. For further information on the properties and suggested uses of these resins, please consult the appropriate product bulletin.

 

 Figure 1 / Viscosity Reduction with HELOXY Modifiers

Heloxy 8 Graph 1

 

 

Performance Properties

 

Table 1 / Typical Properties of epoxy resin systems containing HELOXY Modifier 68

 

 

Method

Units

A

B

C

D

E

F

Composition

 

 

 

 

 

 

 

 

EPON Resin 828

 

pbw

100

90

85

80

85

85

HELOXY Modifier 8

 

pbw

10

15

20

15

15

Triethylenetetramine

 

pbw

13

12.5

12

12

EPI-CURE 3072 Curing Agent

 

pbw

33

Hexahydrophthalic Anhydride

 

pbw

77

Diethylaminoethanol

 

pbw

0.5

 

 

 

 

 

 

 

 

 

Handling Properties at 25°C

 

 

 

 

 

 

 

 

Viscosity, Resin Portion

 

cP

11,000

2,050

1,100

610

1,100

1,100

Gel time, 100g @ 23 °C

 

min.

37

48

60

74

73

¼ in. thick, @ 93 °C

 

min.

90

Peak Exotherm, 100g @ 23 °C

 

°C

223

184

176

173

124

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

106

90

79

66

68

98

Tensile strength, Ultimate

ASTM D638

psi

12,300

10,900

9,400

7,800

7,900

12,000

Tensile elongation at Break

 

%

4.9

6.1

11

13

76

8.3

Tensile Modulus, Initial

 

ksi

470

470

430

370

320

460

Flexural Strength, Ultimate

ASTM D790

psi

19,500

18,300

15,600

12,400

11,100

19,600

Flexural Modulus, Initial

 

ksi

480

470

420

350

320

460

Compressive Strength, Ultimate

ASTM D695

psi

42,000

35,000

29,000

24,000

24,000

37,000

Compressive Yield Strength

 

psi

16,200

13,100

12,000

10,100

10,500

15,100

Izod Impact – notch

ASTM D256

ft.•lb./in.

0.45

0.54

0.60

0.61

0.67

0.46

Weight Loss, 24 hrs. @ 150 °C

 

%

0.24

051

0.94

1.49

1.07

0.21

 

 

 

 

 

 

 

 

 

Percent Absorbtion 2

 

 

 

 

 

 

 

 

Water

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.16

0.14

0.15

0.17

0.20

0.09

1 week

 

 

0.38

0.36

0.41

0.46

0.55

0.25

5% Acetic Acid

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.21

0.30

0.47

0.63

0.90

0.09

1 week

 

 

0.58

0.80

1.26

1.68

2.37

0.25

Solvent 3

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.02

0.04

0.32

1.85

6.69

0.05

1 week

 

 

0.05

016

1.63

6.51

0.22

Dielectric Constant 4

ASTM D150

 

3.91

3.93

3.91

3.84

3.72

3.45

Dissipation Factor 4

 

 

0.031

026

0.023

0.032

0.016

0.011

Volume Resistivity

 

ohm•cm

 

 

 

 

 

 

at 25 °C

 

 

2.3(1015)

2.4(1015)

2.1(1015)

4.0(1015)

>1016

at 66 °C

 

 

6.1(1013)

1.1(1013)

2.8(1012)

2.5(1012)

4.3(1015)

at 93 °C

 

 

2.4(1012)

3.2(1011)

1.4(1010)

6.4(1010)

2.4(1015)

at 130 °C

 

 

3.6(109)

< 109

< 109

<109

1.8(1014)

1Determined on 0.125 thick specimens at 23 °C. Systems A through C cured 16 hours at 25 °C plus 2 hours at 100 °C. Systems D and E cured 14 days at 25 °C. System F cured 2 hours at 93 °C plus 2 hours at 200 °C.

2Weight gain of 3 inch x 1 inch x 0.125 inch specimens totally immersed in reagent at 25 °C.

350:50 by weight mix of isopropanol and xylene.

4Determined at 106 hertz.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

HELOXY Modifier 8 should be stored in tightly sealed containers, in a dry location at normal room temperature. Some epoxy materials can crystallize during storage. The tendency to do so is affected by storage conditions, composition and other factors. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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