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Technical Data Sheet

 

Re-issued September 2007

 

HELOXY™ Modifier 107

 

Product Description

HELOXY™ Modifier 107 is the diglycidyl ether of cyclohexane dimethanol. While it is primarily used as a reactive diluent or viscosity reducing modifier for epoxy resin formulations, it also can effectively serve as a reactive intermediate for further synthesis of various cycloaliphatic based resins.

 

Application Areas/Suggested Uses

  • To improve air release and wetting characteristics or to increase pot life in electrical, potting, encapsulation, and impregnation applications
  • To maintain high reactivity yet provide workable viscosity at room temperature when using novolac or other high functionality epoxy resins

 

Benefits

  • Reduces viscosity of epoxy formulations while maintaining most cured state properties
  • Provides excellent cured state resistance to creep or deformation under high stress
  • Is an effective means of incorporating a cycloaliphatic structure into the polymer chain

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

155-165

ASTM D1652

Viscosity at 25°C

cP

55-75

ASTM D445

Color

Gardner

1 max.

ASTM D1544

Epichlorohydrin

mg/kg

10 max.

SMS 2445

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

9.0-9.2

ASTM D1475

Flash point, Setaflash

°F

>200

 

 

 

 

 

 

 

General Information

HELOXY Modifier 107 is fully compatible with the entire bisphenol A based series of epoxy resins as well as higher functionality epoxy resins. Concentrations of up to 40 percent of HELOXY Modifier 107 have been employed for viscosity reduction. Performance properties of systems containing this resin are maintained at higher modifier concentrations than is possible with monoepoxide diluents and most diepoxide diluents.

 

Effect of HELOXY Modifier 107 modifications on the properties of various EPON™ Resin 828 based systems is demonstrated by data presented in Table 1. Substituting HELOXY Modifier 107 for Epon Resin 828 or other unmodified resins generally results in slight increases in flexibility. As with all diluting modifiers, use of HELOXY Modifier 107 decreases chemical resistance and elevated temperature performance. To minimize such losses, the lowest concentration of HELOXY Modifier 107 necessary to obtain desired reduction in viscosity should be used. The viscosity reduction efficiency of HELOXY Modifier 107 when blended with Epon Resin 828 is compared to that of other HELOXY Modifiers by data illustrated in Figure 1.

 

When formulating with HELOXY Modifier 107, the concentration of curing agent to be used will likely be different than in the case of an unmodified system. The proper curing agent combining ratio should always be calculated in order to ensure proper stoichiometric balance.

 

Figure 1 / Viscosity Dilution Effectiveness of HELOXY Modifiers

 

Heloxy 107 Graph 1

Performance Properties

 

Table 1 / Effects of HELOXY Modifier 107 on Properties of Epoxy Resin Systems

 

 

 

 

Aliphatic Amine

Aromatic Amine

Anhydride

 

Method

Units

A

B

C

D

E

F

Composition

 

 

 

 

 

 

 

 

EPON Resin 828

 

pbw

100

75

100

75

100

75

HELOXY Modifier 107

 

pbw

25

25

25

Triethylenetetramine

 

pbw

13

13.5

EPIKURE™ Curing Agent 3484

 

pbw

20

21

Methyltetrahydrophthalic Anhydride

 

pbw

79

82

Diethylaminoethanol

 

pbw

0.5

0.5

 

 

 

 

 

 

 

 

 

Handling Properties at 25°C

 

 

 

 

 

 

 

 

Viscosity, Resin Portion

 

cP

11,000

1,620

11,000

1,620

11,000

1,620

Gel time, 100g @ 23 °C

 

min.

 

 

 

 

 

 

At 23 °C, 100 g

 

 

37

46

At 93 °C, ¼ in. thick

 

 

54

93

At 150 °C, stroke method

 

 

5.2

5.6

At 170 °C, stroke method

 

 

4.5

5.7

Peak Exotherm, 100g @ 23 °C

 

°C

223

212

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

67

66

173

149

117

101

Tensile strength, Ultimate

ASTM D638

psi

9,600

11,600

10,700

10,200

13,500

12,900

Tensile elongation at Break

 

%

1.7

3.7

4.0

4.6

6.3

6.0

Tensile Modulus, Initial

 

ksi

590

520

420

380

510

490

Flexural Strength, Ultimate

ASTM D790

psi

16,700

17,900

14,500

14,600

21,900

21,000

Flexural Modulus, Initial

 

ksi

570

510

400

370

480

480

Compressive Strength, Ultimate

ASTM D695

psi

19,100

11,700

32,000

36,000

46,000

38,000

Compressive Yield Strength

 

psi

10,100

9,500

17,900

15,400

16,500

16,000

Izod Impact – notch

ASTM D256

ft.•lb./in.

0.40

0.47

0.45

0.48

0.43

0.53

Weight Loss, 24 hrs. @ 150 °C

 

%

0.29

0.33

0.23

0.36

0.04

0.06

 

 

 

 

 

 

 

 

 

Percent Absorbtion 2

 

 

 

 

 

 

 

 

Water

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.17

0.20

0.23

0.24

0.14

0.13

1 week

 

 

0.46

0.56

0.64

0.65

0.34

0.34

5% Acetic Acid

 

%

 

 

 

 

 

 

24 hrs.

 

 

1.53

2.84

0.23

0.24

0.13

0.13

1 week

 

 

4.83

7.44

0.64

0.65

0.34

0.33

Solvent 3

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.88

1.89

0.05

0.06

0.04

0.07

1 week

 

 

1.97

3.52

0.18

0.23

0.09

0.28

Dielectric Constant 4

ASTM D150

 

4.26

4.32

4.24

4.27

3.61

3.68

Dissipation Factor 4

 

 

0.022

0.026

0.037

0.042

0.014

0.016

1 Determined on 0.125 in. thick specimens at 23 °C. Systems A and B cured two weeks at 25 °C. Systems C and D cured two hours at 93 °C, plus two hours at 150 °C. Systems E and F curedtwo hours at 93 °C, plus two hours at 175 °C.

2 Weight gain of 3 in. x 1 in. x 0.125 in. Specimens totally immersed in reagent at 25 °C.

3 50:50 by weight mix of isopropanol and xylene.

4 Determined at 106 hertz.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

HELOXY Modifier 107 should be stored in tightly sealed containers in a dry location at normal room temperature. Some epoxy material can crystallize during storage. The tendency to do so is affected by storage conditions, composition, and other factors. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/ 

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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