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Technical Data Sheet

 

Re-issued September 2007

 

HELOXY™ Modifier 71

 

Product Description

HELOXY™ Modifier 71 is an undiluted amber colored, low-viscosity liquid, aliphatic epoxy ester resin that imparts increased flexibility and resistance to thermal shock when blended with conventional liquid bisphenol A based epoxy resins.

 

Application Areas/Suggested Uses

  • Adhesives
  • Body solders
  • Caulking and sealing compounds
  • Electrical casting and encapsulating
  • Glass to metal glazing compositions
  • Large castings
  • Tooling compositions
  • Filament winding

 

Benefits

  • A low-viscosity flexibilizer that serves as a viscosity depressing agent.
  • A product that improves impact strength and toughness to a conventional liquid bisphenol A epoxy resin.

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

390-470

ASTM D1652

Viscosity at 25°C

cP

400-900

ASTM D445

Color

Gardner

10

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Physical form

 

Clear amber liquid

 

Density @ 25 °C

lbs/gal

8.2

 

Gravity, Specific @ 25 °C

 

0.98

 

Flash point

°C

140

 

 

 

 

 

 

 

Curing Agents

Blends of HELOXY Modifier 71 and EPON™ Resin 828 can be cured with all curing agents except the polyamine adducts (i.e., EPIKURE™ Curing Agent 3282), which produce incompatible cured products.

 

Depending upon the ratio of resin blend and the hardener used, the elongation at break can range as high as 200-300%, although 50-100% is more common. The use of HELOXY Modifier 71 as the sole resin in a formulation is not recommended. As in the case of most common flexibilizers, high concentrations of HELOXY Modifier 71 tend to decrease the superior chemical resistance of unmodified epoxy resin systems. Also, experience has shown that optimum tensile properties are normally reached with elevated temperature cures because there is a tendency for room temperature amine cured systems to age harden. Results obtained with various curing agent systems reported in the following sections are intended as a guide when selecting an EPON Resin 828/HELOXY Modifier 71/ EPIKURE Curing Agent system for your specific application.

 

Cure with Aliphatic Amine Curing Agents

Blends of HELOXY Modifier 71 and EPON Resin 828 cured with aliphatic amines yield a wide range of flexible to semi-rigid polymers. The final properties of these polymers are affected by the type of amine curing agent and the ratio of HELOXY Modifier 71 to EPON Resin 828. Although most of the data presented in this technical bulletin is based on systems cured at elevated temperatures, data is included which show that EPI-CURE Curing Agents 3223 and 3200 are effective room temperature curing agents.

 

Table 1 illustrates the effect of the type of amine curing agent on tensile properties of several HELOXY Modifier 71/EPON Resin 828 blends cured for 4 hours at 125 °C.

 

The effect of aging on tensile properties was studied using EPI-CURE Curing Agents 3223 and 3200 at a given ratio of HELOXY Modifier 71 to EPON Resin 828 (75% HELOXY Modifier/ 25% EPON Resin). The results of this study are summarized in Table 2. In this second table, you will note that a more complete cure is achieved when the system is force cured, versus curing at ambient temperatures.

 

In Table 3, gel times are displayed for various HELOXY Modifier 71 and EPON Resin 828 blends cured with either EPIKURE Curing Agent 3223 or EPIKURE Curing Agent 3200 determined in one quart masses. You will note that either HELOXY Modifier 71 alone or blends of HELOXY Modifier 71 and EPON Resin 828 impart somewhat slower curing than EPON Resin 828, as evidenced by the significantly longer gel times.

 

Cure with an Aromatic Diamine

In Table 4, data on blends of HELOXY Modifier 71 and EPON Resin 828 cured with ANCAMINE® Z (4,4'-Methylenedianiline), an aromatic diamine, are summarized. You will note a wide range of tensile properties can be achieved depending on the ratio of EPON Resin 828 and HELOXY Modifier 71.

 

Cure with Acid Anhydrides

As with amine curing agents, acid anhydrides can be used with HELOXY Modifier 71 or blends of this resin with EPON Resin 828 to produce tough, flexible polymers. Curing agent accelerators or catalysts, such as EPIKURE Curing Agent 3253 or benzyl dimethylamine (Aceto Corporation), are used to reduce the required cure time and cure temperature. Table 5 displays data on HELOXY Modifier 71 cured with two popular acid anhydrides. Table 6 displays tensile properties of several blends of HELOXY Modifier 71 and EPON Resin 828 cured with NADIC Methyl Anhydride. Again, you will note that adjusting the flexibilizer level in the EPON Resin 828 allows broad latitude in formulating a system with the desired tensile strength and elongation properties.

 

Cure with Lewis Acids

Table 7 compiles tensile properties on a 75/25 by weight blend of HELOXY Modifier 71/ EPON Resin 828, cured with various levels of boron trifluoride monoethylamine. In this study, four parts of boron trifluoride monoethylamine appears to be the optimal level of Lewis acid.

 

Accelerators

Another study was undertaken to determine the effect of phenolic accelerators on the properties of HELOXY Modifier 71 systems. Our laboratory determined that a formulator could add up to 5 parts of phenol per 100 parts of HELOXY Modifier 71 with no effect on tensile elongation. Higher levels of phenol decrease tensile strength and exhibit a deleterious effect on chemical resistance.

 

FDA Status

HELOXY Modifier 71 is not listed under the Code of Federal Regulations (21 CFR); therefore, Hexion cannot recommend its use for food contact applications.

 

Performance Properties

 

Table 1 / Tensile properties of HELOXY Modifier 71 / EPON Resin 828 blends cured with aliphatic amine curing agents – Cure schedule: 4 hours at 125 °C

 

Resin Blend

 

 

Tensile Properties1

HELOXY Modifier 71

EPON Resin 828

Curing Agent

Concentration, phr2

Ultimate strength, psi

Ultimate elongation, %

100

0

EPIKURE Curing Agent 3223

5.2

150

39

80

20

EPIKURE Curing Agent 3223

6.3

1180

53

60

40

EPIKURE Curing Agent 3223

7.4

4240

6

40

60

EPIKURE Curing Agent 3223

8.4

5680

2

100

0

EPIKURE Curing Agent 3200

10.8

200

60

80

20

EPIKURE Curing Agent 3200

13.2

1540

99

60

40

EPIKURE Curing Agent 3200

15.5

4140

48

40

60

EPIKURE Curing Agent 3200

18.0

8840

9

1 Based on ASTM D638. Crosshead speed: 20 inches/minute.

2 Parts of curing agent per 100 parts of resin.

 

Table 2 / Effect of aging on tensile properties of a HELOXY Modifier 71 / EPON Resin 828 system (75% HELOXY Modifier 71/25% EPON Resin 828)

 

 

 

Cure Schedule

Aging Conditions

Tensile Properties1

Curing Agent

Concentration phr2

Time

Temp. °C

Time

Temp. °C

Ultimate strength psi

Ultimate elongation psi

Crosshead speed in./min.

EPIKURE Curing Agent 3200

13.8

4 hours

125

2610

100

20

EPIKURE Curing Agent 3200

13.8

4 hours

125

3 days

100

2600

88

20

EPIKURE Curing Agent 3200

13.8

4 hours

125

8 days

100

2760

80

20

EPIKURE Curing Agent 3200

13.8

4 hours

125

30 days

100

3170

99

20

EPIKURE Curing Agent 3200

13.8

4 hours

125

30 days

23

2790

86

20

EPIKURE Curing Agent 3200

13.8

7 days

25

1900

100

2

EPIKURE Curing Agent 3200

13.8

7 days

25

13 days

25

1450

77

2

EPIKURE Curing Agent 3200

13.8

7 days

25

23 days

25

1350

75

2

EPIKURE Curing Agent 3223

6.6

7 days

25

1600

35

2

EPIKURE Curing Agent 3223

6.6

7 days

25

7 days

82

2500

25

2

1 Based on ASTM D638.

2 Parts of curing agent per 100 parts of resin.

 

Table 3 /Gel times for various HELOXY Modifier 71/EPON Resin/EPIKURE Curing Agent combinations (one quart mass at room temperature)

 

HELOXY Modifier 71

EPON Resin 828

Curing Agent

Concentration phr1

Gel Time minutes

100

0

EPIKURE Curing Agent 3200

10.5

185

100

0

EPIKURE Curing Agent 3223

5.2

185

75

25

EPIKURE Curing Agent 3200

13.8

60

75

25

EPIKURE Curing Agent 3223

6.6

80

0

100

EPIKURE Curing Agent 3200

22.0

15-20

0

100

EPIKURE Curing Agent 3223

12.0

15-20

1 Parts of curing agent per 100 parts of resin.

 

Table 4 / Tensile properties of HELOXY Modifier 71/EPON Resin 828 blends cured with ANCAMINE® Z (4,4'-Methylenedianiline) – Cure schedule: 2 hours at 80 °C, 3 hours at 150 °C

 

Resin Formulation

 

Tensile Properties1

HELOXY Modifier 71

EPON Resin 828

ANCAMINE ® Z

Concentration, phr2

Ultimate strength, psi

Ultimate elongation, %

100

0

10.0

430

86

80

20

12.3

2160

47

60

40

14.5

6770

13

40

60

16.3

9540

5

0

100

20.0

13000

5

1 Based on ASTM D638. Crosshead speed: 20 inches/minute.

2 Parts of curing agent per 100 parts of resin.

 

Table 5 /Tensile properties of HELOXY Modifier 71 cured with anhydrides

 

 

 

 

Cure Schedule

Tensile Properties1

Curing Agent

Concentration phr2

EPIKURE Curing Agent 3253, phr2

Time

Time., °C

Ultimate strength, psi

Ultimate elongation, %

NMA3

47

1.8

3 hours

100

1250

70

NMA

23.5

2.1

3 hours

100

416

80

DDSA4

69

4.6

2 hours

110

1280

120

1 Based on ASTM D638. Crosshead speed: 2 inches/minute.

2 Parts of curing agent or accelerator per 100 parts of resin.

3 NADIC Methyl Anhydride (Anhydrides and Chemicals, Inc.).

4 Dodecenylsuccinic Anhydride (Anhydrides and Chemicals, Inc.).

 

Table 6 / Tensile properties of HELOXY Modifier 71/EPON Resin 828 blends cured with NADIC methyl anhydride 1

 

 

 

 

Tensile Properties2

HELOXY Modifier 71

EPON Resin 828

NMA, phr3

Ultimate strength, psi

Ultimate elongation, %

100

0

44.8

800

70

80

20

54.6

5090

17

60

40

64.3

9500

6

40

60

72.3

8890

3

1 1% weight of benzyldimethylamine was added as a catalyst. The cure schedule was 4 hours at 120 °C, plus an additional 4 hours at 200 °C to assure maximum cure of the systems.

2 Based on ASTM D638. Crosshead speed: 2 inches/minute.

3 Parts of curing agent per 100 parts of resin.

 

Table 7/ Tensile properties of HELOXY Modifier 71 and an HELOXY Modifier 71 / EPON Resin 828 blend cured with boron trifluoride monoethylamine1

 

 

 

 

Cure Schedule

Tensile Properties2

HELOXY Modifier 71

EPON Resin 828

BF3MEA, phr3

Time

Temp., °C

Ultimate strength, psi

Ultimate elongation, %

100

0

3

2 hours

120

130

35

 

 

 

+1 hour

170

 

 

 

 

 

+3 hours

200

 

 

75

25

3

2 hours

120

600

37

 

 

 

+2 hours

200

 

 

75

25

4

2 hours

120

630

43

 

 

 

+2 hours

200

 

 

75

25

5

2 hours

120

290

57

 

 

 

+2 hours

200

 

 

1 Harshaw Chemical Company or Pacific Anchor Chemical.

2 Based on ASTM D638. Crosshead speed: 2 inches/minute.

3 Parts of curing agent per 100 parts of resin.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

CAUTION: Hexion has found that HELOXY Modifier 71 will have a viscosity/epoxide equivalent weight increase of about 10% per month when stored at 30 °C (86 °F). As this occurs, the compatibility with other epoxy resins, such as EPON Resin 828, will decrease. We recommend the product be stored at 13 °C (55 °F), or lower, in order to maintain a reasonable shelf life. Also, the oldest production of HELOXY Modifier 71 should be consumed first. Typical storage/ stability time and temperatures are listed as follows:

 

 

 Storage temperature

 Estimated shelf life

 55°F

1 year 

 75°F

 5 months

 90°F

 2 1/2 months

 105°F

 1 month

 

It should be noted that, if the product is subjected to excessive heating while compounding, the shelf life could be significantly reduced. Your manufacturing processes should be modified accordingly.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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