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Technical Data Sheet

 

Re-issued October 2008

 

HELOXY™ Modifier 68

 

Product Description

HELOXY™ Modifier 68 is a diglycidyl ether of neopentyl glycol and is primarily used as a reactive diluent or viscosity reducing modifier for all classes of epoxy resins.

 

Application Areas/Suggested Uses

  • To improve air release and wetting characteristics in electrical potting, encapsulation, and impregnation applications.
  • To maintain high reactivity yet provide workable viscosity at room temperature when using epoxy novolac or other high functionality epoxy resins.

 

Benefits

  • Reduces viscosity while maintaining most cured state properties
  • Improves wetting characteristics
  • Facilitates air release

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

130-145

ASTM D1652

Viscosity at 25°C

cP

13-25

ASTM D445

Color

Gardner

1

ASTM D1544

Epichlorohydrin

mg/kg

10

SMS 2445

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

8.8-9.0

ASTM D1475

Flash Point, Setaflash

°F

>200

 

 

 

 

 

 

 

General Information

HELOXY Modifier 68 is compatible with bisphenol- based epoxy resins, peroxidized olefins, and higher functionality epoxy resins. Concentrations of up to 40 percent of HELOXY Modifier 68 have been employed for viscosity reduction. Performance properties of systems containing this resin are maintained at higher modifier concentrations than is possible with monoepoxide diluents.

 

Effects of HELOXY Modifier 68 modification on the properties of various EPON™ Resin 828 based systems is demonstrated by data presented in Table 1. Substituting HELOXY Modifier 68 for EPON Resin 828 or other unmodified resins generally results in slight increases in flexibility. As with all diluting modifiers, use of HELOXY Modifier 68 decreases chemical resistance and elevated temperature performance. To minimize such losses, the lowest concentration of HELOXY Modifier 68 necessary to obtain desired reduction in viscosity should be used. The viscosity reduction efficiency of HELOXY Modifier 68 when blended with EPON Resin 828 is compared to that of other HELOXY modifiers by data illustrated in Figure 1.

 

Figure 1 / Viscosity Dilution Effectiveness of HELOXY Modifiers

 

Heloxy 68 Graph 1

 

When formulating with HELOXY Modifier 68, the concentration of curing agent to be used will likely be different than in the case of an unmodified system. The proper curing agent combining ratio should always be calculated in order to ensure proper stoichiometric balance.

 

Performance Properties

 

Table 1 / Typical Properties of epoxy resin systems containing HELOXY Modifier 68

 

 

 

 

Aliphatic Amine

Anhydride

Composition

Method

Units

A

B

C

D

EPON Resin 828

 

pbw

100

80

100

80

HELOXY Modifier 68

 

pbw

20

20

EPIKURE Curing Agent 3234

 

pbw

12.9

14

Methyltetrahydrophthalic Anhydride

 

pbw

79

85

Diethylaminoethanol

 

pbw

0.5

0.5

 

 

 

 

 

 

 

Handling Properties at 25°C

 

 

 

 

 

 

Viscosity, Resin Portion

 

cP

13,250

1,415

11,000

1,320

Gel time, 100g @ 23 °C

 

 

 

 

 

 

at 23 °C, 100 g

 

min.

44

45

at 93 °C, 1/4 inch thick

 

min.

at 150 °C, stroke method

 

min.

5.2

6.0

at 170 °C, stroke method

 

min.

Peak Exotherm, 100g @ 23 °C

 

°C

223

222

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

67

67

117

99

Tensile strength, Ultimate

ASTM D638

psi

9,600

11,500

13,500

12,900

Tensile elongation at Break

 

%

1.7

3.4

6.3

6.6

Tensile Modulus, Initial

 

ksi

590

520

510

490

Flexural Strength, Ultimate

ASTM D790

psi

16,700

18,000

21,900

21,000

Flexural Modulus, Initial

 

ksi

570

530

480

510

Compressive Strength, Ultimate

ASTM D695

psi

19,100

13,000

46,000

35,000

Compressive Yield Strength

 

psi

10,100

9,600

16,500

16,100

Izod Impact – notch

ASTM D256

ft.•lb./in.

0.40

0.47

0.43

0.52

Weight Loss, 24 hrs. @ 150 °C

 

%

0.29

0.30

0.04

0.07

 

 

 

 

 

 

 

Percent Absorbtion 2

 

 

 

 

 

 

Water

 

%

 

 

 

 

24 hrs.

 

 

0.17

0.21

0.14

0.13

1 week

 

 

0.46

0.56

0.34

0.33

5% Acetic Acid

 

%

 

 

 

 

24 hrs.

 

 

1.53

3.46

0.13

0.13

1 week

 

 

4.83

8.55

0.34

0.32

Solvent 3

 

%

 

 

 

 

24 hrs.

 

 

0.88

2.04

0.04

0.05

1 week

 

 

1.97

3.76

0.09

0.19

Dielectric Constant 4

ASTM D150

 

4.26

4.26

3.61

3.66

Dissipation Factor 4

 

 

0.022

0.026

0.014

0.016

1Determined on 0.125 thick specimens at 23 °C. Systems A through C cured 16 hours at 25 °C plus 2 hours at 100 °C. Systems D and E cured 14 days at 25 °C. System F cured 2 hours at 93 °C plus 2 hours at 200 °C.

2Weight gain of 3 inch x 1 inch x 0.125 inch specimens totally immersed in reagent at 25 °C.

350:50 by weight mix of isopropanol and xylene.

4Determined at 106 hertz.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

Some epoxy material can crystallize during storage. The tendency to do so is affected by storage conditions, composition, and other factors. Should crystallization occur, it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F).

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/

 

For literature and technical assistance, visit our website at: www.hexion.com

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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