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Technical Data Sheet

 

Re-issued January 2017

 

HELOXY™ Modifier 62

 

Product Description

HELOXY™ Modifier 62 is a commercial grade of o-cresyl glycidyl ether. A low viscosity aromatic monoepoxide, its primary use is the viscosity reduction of conventional epoxy resin systems.

 

Benefits

  • Reduces viscosity of higher molecular weight aromatic epoxy resins
  • Excellent retention of mechanical and chemical resistance cured state properties relative to other monoepoxides
  • Low volatility
  • Improves substrate and filler wetting of conventional formulations

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

175-195

ASTM D1652

Viscosity at 25°C

cP

5-10

ASTM D445

Color

Pt-Co

100 max.

ASTM D1209

Epichlorohydrin

mg/kg

20 max.

SMS 2445

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density

lbs/gal

8.9-9.1

ASTM D1475

 

 

 

 

 

 

General Information

HELOXY 62 is compatible with virtually all classes of epoxy resins used in thermoset plastics and protective coatings applications.

 

As with any monoepoxide, modification of basic epoxy resins with HELOXY 62 reduces the average epoxide functionality of the mixture thereby lowering cured state chemical and solvent resistance and thermal performance. However, due to the highly aromatic structure of HELOXY 62, compromises in these properties are found to be minimized relative to those associated with other monoepoxides commonly used in the viscosity reducing modification of epoxy formulations.

 

The relatively low molecular weight of HELOXY 62 makes it among the most efficient of the aromatic monoepoxides in reducing viscosity of basic epoxy resins. A comparison of this characteristic to that of other representative Heloxy modifiers is illustrated in Figure 1. Since the degree to which performance properties are affected depends on the amount of Heloxy 62 in the formulation, the amount used should be limited to that necessary to yield the required viscosity reduction. The maximum recommended quantity of Heloxy 62 is about 30 percent of the resin portion. Curing agents that are recommended for satisfactory crosslinking of unmodified basic liquid epoxy resins can also be used with compositions containing HELOXY 62. Since the average weight per epoxide of HELOXY 62 is virtually identical to that of commercial liquid bisphenol A-based epoxy resins, differences in epoxy content due to HELOXY 62 modifications are normally insignificant and adjustments in curing agent combining ratio to maintain proper stoichiometry with HELOXY 62 modified blends is usually unnecessary.

 

As previously stated, the cured state properties at room temperature of epoxy formulations are not seriously affected when viscosity reduction is attained via HELOXY 62 unless excessive amounts are used. However, performance at elevated service temperatures may be reduced considerably. Data listed in Table 1 illustate the effect of HELOXY 62 on systems cured with various curing agents, including conventional polyamines, anhydrides, and EPIKURE™ 3072 Curing Agent. A preblend of HELOXY 62 and a standard bisphenol A based epoxy resin at a viscosity selected for ease of handling is available as EPON™ Resin 813. For information on the properties and suggested uses of this resin, please consult the appropriate product bulletin.

 

Figure 1 / Viscosity dilution effectiveness of HELOXY Modifiers

 

 

Heloxy 62 Graph 1

Performance Properties

 

Table 1 / Typical Properties of epoxy resin systems containing HELOXY Modifier 62

 

 

Method

Units

A

B

C

D

E

F

Composition

 

 

 

 

 

 

 

 

EPON Resin 828

 

pbw

100

90

80

77

70

77

HELOXY Modifier 62

 

pbw

10

20

23

30

23

EPIKURE 3234

 

pbw

12.9

13

13.5

EPIKURE 3072 Curing Agent

 

pbw

35

35

Hexahydrophthalic Anhydride

 

pbw

78

Diethylaminoethanol

 

pbw

0.5

 

 

 

 

 

 

 

 

 

Handling Properties at 25°C

 

 

 

 

 

 

 

 

Viscosity, Resin Portion

 

cP

13,250

3,100

1,060

1,000

470

1,000

Gel time, 100g @ 23 °C

 

min.

44

43

45

52

57

¼ in. thick, @ 93 °C

 

min.

75

Peak Exotherm, 100g @ 23 °C

 

°C

223

223

211

168

147

 

 

 

 

 

 

 

 

 

Cured State Properties 1

 

 

 

 

 

 

 

 

Heat Deflection Temperature

ASTM D648

°C

103

86

69

64

58

98

Tensile strength, Ultimate

ASTM D638

psi

10,050

11,400

11,300

9,600

8,400

13,300

Tensile elongation at Break

 

%

3.7

5.3

6.3

5.2

10.5

5.9

Tensile Modulus, Initial

 

ksi

450

500

570

460

430

550

Flexural Strength, Ultimate

ASTM D790

psi

18,700

20,200

20,900

14,300

12,400

22,000

Flexural Modulus, Initial

 

ksi

470

510

580

420

360

530

Compressive Strength, Ultimate

ASTM D695

psi

33,400

27,900

30,300

19,000

19,000

34,000

Compressive Yield Strength

 

psi

15,650

14,900

15,500

13,600

11,700

16,400

Izod Impact – notch

ASTM D256

ft.•lb./inch

0.45

0.45

0.40

0.47

0.43

0.38

Weight Loss, 24 hrs. @ 150 °C

 

%

0.24

0.8

1.55

1.44

2.06

0.15

 

 

 

 

 

 

 

 

 

Percent Absorbtion 2

 

 

 

 

 

 

 

 

Water

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.168

0.08

0.07

0.17

0.19

0.07

1 week

 

 

0.38

0.26

0.25

0.47

0.52

0.20

5% Acetic Acid

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.21

0.20

0.19

0.77

0.82

0.07

1 week

 

 

0.58

0.61

0.74

1.97

2.13

0.21

Solvent 3

 

%

 

 

 

 

 

 

24 hrs.

 

 

0.02

-0.08

-0.05

7.55

10.8

0.07

1 week

 

 

0.05

-0.17

-0.09

0.51

Dielectric Constant 4

ASTM D150

 

3.91

3.80

3.83

3.65

3.68

3.48

Dissipation Factor 4

 

 

0.031

0.020

0.017

0.013

0.013

0.011

1Determined on 0.125 thick specimens at 23 °C. Systems A through C cured 16 hours at 25 °C plus 2 hours at 100 °C. Systems D and E cured 14 days at 25 °C. System F cured 2 hours at 93 °C plus 2 hours at 200 °C.

2Weight gain of 3 inch x 1 inch x 0.125 inch specimens totally immersed in reagent at 25 °C.

350:50 by weight mix of isopropanol and xylene.

4Determined at 106 hertz.

 


 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/ 

 

For literature and technical assistance, visit our website at: www.hexion.com

 

 

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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