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Technical Data Sheet

 

Re-issued August 2001

 

 

EPIKOTE™ Resin 1163 and 1163-T-60

 

 

Product Description

EPIKOTE™ Resin 1163, a highly brominated epoxy resin, is designed for applications requiring a high degree of flammability resistance. It is a solid epoxy resin with a relatively low softening point and will sinter or block at room temperature. EPIKOTE Resin 1163 is commonly handled in solvent for laminating applications, as a hot melt for casting and molding compound applications, or as a blend with liquid epoxy resins for miscellaneous casting, potting, encapsulation and floor topping uses that require processing at ambient or slightly elevated temperatures.

 

EPIKOTE Resin 1163 is also commercially available as a solution in toluene at 60 weight percent solids, designated as EPIKOTE Resin 1163-T-60.

 

EPIKOTE Resin 1163 is a reaction product of tetrabromobisphenol A and epichlorohydrin.

 

 

Sales Specification

Property

Units

Value

Test Method/Standard

EPIKOTE Resin 1163

 

 

 

Weight per Epoxide

g/eq

380 – 410

SMS 2026

Color

Pt-Co

200 max.1

SMS 2858

EPIKOTE Resin 1163-T-60

 

 

 

Weight per Epoxide

g/eq

380 – 410

ASTM D1652

Color

Pt-Co

300 max.

ASTM D1209

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

EPIKOTE Resin 1163

 

 

 

Viscosity at 25°C

 

---

 

Bromine Content

% wt.

50

 

Solids

% wt.

100

ASTM D1259

Softening Point

°C

64

 

Density at 25°C

g/cc

1.84

 

Appearance

 

Off white, coarse powder 2

 

EPIKOTE Resin 1163-T-60

 

 

 

Viscosity at 25°C

cP

10

 

Bromine Content

% wt.

50

 

Solids

% wt.

59 – 61

ASTM D1259

Softening Point

°C

---

 

Density at 25°C

g/cc

1.27

 

Appearance

 

Transparent liquid

 

 

 

 

 

180 weight percent solution in methylethylketone.

2 EPIKOTE Resin 1163 will sinter or block at room temperature.

 

 

Processing/How to use

 

Applications

EPIKOTE Resin 1163 offers an alternative for formulators seeking replacements for tetrabromobisphenol A, octa- and decabromodiphenyl oxides, antimony trioxide, phosphorus compounds, and other flame retardant additives for a variety of applications. EPIKOTE Resin 1163 can be used in laminating, powder coating, or composite applications, to manufacture flame retardant vinyl esters, or as a flame retardant additive for thermoplastic polymers. EPIKOTE Resin 1163-T-60 is widely used as a reactive flame retardant component for phenolic resins used for the manufacture of printed circuit boards conforming to NEMA FR-1 and FR-2 specifications. EPIKOTE Resin 1163-T-60 can also be used for high performance circuit board applications including the epoxy-based FR-4 and FR-5 grades.

 

Processing

EPIKOTE Resin 1163 is advantaged by its relatively low melt viscosity (see Figure 1), high bromine content, very good compatibility with epoxy resins, and efficient flame retardant performance. In epoxy based resin systems, 10-20 weight percent bromine is generally sufficient to impart the desired level of flammability resistance. Blending EPIKOTE Resin 1163 with bisphenol A-based epoxy resins and/or reactive diluents to reduce the bromine content of the total system is a common practice and such modifications often result in a liquid product. A composition’s resistance to flame spread can also be enhanced by adding a synergistic flame retardant such as antimony trioxide or an intumescing agent such as ammonium polyphosphate.

 

Figure 1 / Temperature-viscosity relationship of EPIKOTE™ Resin 1163

 

EPON 1163 Figure 1

 

Standard epoxy curing agents can be employed with EPIKOTE Resin 1163. While the reactivity of EPIKOTE Resin 1163 varies slightly from that of the liquid bisphenol A-based epoxy resins, cure schedules commonly employed with conventional epoxy systems are suggested as a starting point.

 

 

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Hexion web site for Shelf Life and recommended Storage information.

 

EPIKOTE Resin 1163 and EPIKOTE Resin 1163-T-60 should be kept in cool, dry conditions in tightly closed containers, preferably in the original packaging. Under these conditions, the products should have a storage life of at least one year. While EPIKOTE Resin 1163 is prone to “blocking” or sintering (i.e., softening of the particles and agglomeration to a semisolid mass) at or above room temperature, blocking does not affect the performance of the resin. To minimize blocking, the solid material should be stored at temperatures below 60 °F.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, please contact customer service:

www.hexion.com/Contacts/ 

 

For literature and technical assistance, visit our website at: www.hexion.com

® and ™ Licensed trademarks of Hexion Inc.

DISCLAIMER

The information provided herein was believed by Hexion Inc. (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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