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Product

EPON™ Resin 869

EPON™ Resin 869 is a low viscosity epoxy resin produced from the reaction of bisphenol F and epichlorohydrin, containing no diluent. Like other bisphenol F epoxy resins, it has improved chemical resistance and lower viscosity than bisphenol A epoxy resins. Product Description:EPON™ Resin...

Product

EPON Resin 834

" Unmodified Liquid Resin - Semi-solid. Used for prepregs and adhesives properties modifications." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from source...

Product

EPON Resin 164

" Epoxy o-cresylic novolac with functionality of 4.1. High temperature and chemical resistance." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources ...

Product

EPIKOTE Resin MGS BPR 135G-Series and EPIKURE Curing Agent MGS BPH 134G-137GF

Secondary bonding of FRP to FRP and various materials. Production of rotor blades for wind energy plants, shipbuilding, sporting goods, moulds and other devices. Fills gaps of up to approx. 50 mm without sagging, good sag resistance at elevated temperature, mixing ratio with a wide tolerance band. D...

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Bakelite Resin PF1153PS

" Bakelite Resin PF1153PS is a water based phenolic resole solution used in thermal insulation foam applications." Application: PF1153PS is used in thermal insulation foam applications Description: Water based phenolic resole solution Handling: This product has to be used and disposed of according t...

Product

EPIKOTE Resin 5520-W-60

Waterborne dispersion of a modified Bisphenol A epoxy resin (EPON 1002-type)with an organic co-solvent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from s...

Product

EPIKOTE Resin 5392-XI-80

EPIKOTE™ Resin 5392-XI-80 is a fast curable, multifunctional epoxy resin based on bisphenol-A, 80wt% solid solution in xylene and isobutanol(70/30). Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be acc...

Product

EPIKOTE Resin 5003-W-55

Waterborne dispersion of an epoxidized Bisphenol A novolac resin with an average functionality of 3 (EPON SU-3 type). Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or p...

Product

EPON Resin 2005

" Powder Coating / Molding Powder Solids - Standard BPA based resin, melt point 110-120ºC. Provides thicker films." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation o...

Product

EPIKOTE Resin MGS BP 20

Bonding Paste - is ideal for fast-setting bondings in composites applications, especially composite-metal bondings. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or pre...

Product

EPON Resin 1124-A-80

" Resin solution, 80% solids in acetone for FR-4 electrical laminates. 18-20.5% by weight bromine on solids. Imparts fire retardancy." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of...

Product

Durite Resin SL-524B

Durite Resin SL-524B is a liquid phenolic resole resin suitable for foam applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed t...

Product

EPI-REZ Resin 3547-WY-57

EPI-REZ Resin 3547-WY-57 is a nonionic dispersion of a high molecular weight BPA epoxy resin in water and 2-propoxyethanol (EGMPE). It was developed to be similar to EPI-REZ Resin 3540-WY-55 and to be compositionally compliant with many regulations for incidental food contact applications. EPI-REZ R...

Product

Bakelite PF 7595

Phenolic moulding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Bearers for grinding disc centers, gas meter parts, pump parts, sliding/guiding elements, glide bearing parts. Application Areas:...

Product

EPIKURE Curing Agent 105

Mannich base type curing agent with a high reactivity even at low temperatures (down to +5°C) Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources...

Product

Bakelite Resin D_IB-1359E

Bakelite Resin D_IB-1359E is a water-soluble liquid phenolic resole resin used in the preparation of mineral wool insulation. Application: D_IB-1359E is used in the preparation of mineral wool insulation Description: Liquid phenolic resole resin soluble in water Handling: This product has to be used...

Product

Bakelite Resin D_IB-1383E

Bakelite Resin D_IB-1383E is a shelf-stable, fully pre-reacted liquid phenolic resole resin system in water, suitable for the preparation of mineral wool insulation for friction applications. Application: D_IB-1383E is a shelf stable, fully pre-reacted system used in the preparation of mineral wool ...

Product

Durite Resin D_PD-126A

Durite Resin D_PD-126A is a low molecular weight, high purity cresol formaldehyde novolac resin used in semiconductor photoresist applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at th...

Product

EPIKOTE Resin 496

EPIKOTE™ Resin 496 is a low viscosity tetra-functional amine-based epoxy resin. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to...

Product

Formaldehyde 37% Solution

Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand o...

Product

EPIKURE Curing Agent 3230

" D230 polyoxypropylenediamine that has moderate reactivity, low viscosity, low color, low vapor pressure and high primary amine content. It resists ""blush"", ""bloom"" and ""sweat-out"" in epoxy compositions." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provide...

Product

EPIKOTE Resin 357

Low viscosity epoxy resin blend based on a bisphenol F resin and a bisphenol A resin, containing a difunctional reactive diluent. Lower viscosity than EPIKOTE Resin 320. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hex...

Product

EPIKURE Curing Agent 03306

Very low viscosity special curing agent based on a cycloaliphatic amine. In combination with EPIKOTE Resin 03306 especially for crack injection systems. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accur...

Product

Epikote Resin MGS LR485 and Epikure Curing Agent MGS LH485, LH486, LH487

Application that require high heat resistances, aerospace, automotive, tooling and moulding. High heat resistance, good mechanical properties, pot life approx. 0,5 -3 h and short curing times at elevated temperatures....

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