Duration: 9 ms, Number of Results: 258

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Recipe

SF 7011 General Purpose Compounding 1002F

EPON™ Resin 1002F Introduction This general purpose electrical molding compound provides good mechanical and electrical properties for transfer or compression molding of electrical and electronic components. The combination of tetrachlorophthalic anhydride and 3,3’ 4,4’-benzophenon

Recipe

SF 7012 General Purpose Compound 828

EPON™ Resin 828 Introduction This general purpose electrical potting compound provides good mechanical, thermal and electrical properties while curing at moderate temperatures, 90-150 °C. Polyethylene glycol is used to impart a degree of thermal shock resistance to the cured system. Formul

Recipe

SF 7013 Flexible Potting Compound 828

EPON™ Resin 828 Introduction This general purpose electrical potting compound illustrates the use of polyethylene glycol to improve flexibility with minimal sacrifice in mechanical, thermal and electrical properties. Phthalic anhydride, used as the converter, provides acceptable cured state pr

Recipe

SF 7014 Low Exotherm Compound 1001F

EPON™ Resin 1001F Introduction This is a heat curing, low exotherm encapsulating compound particularly useful for potting of large coils and stators. Suggested Uses Encapsulating of electrical components, particularly large units, requiring large resin volumes and low exotherm characteristics.

Recipe

SF 7015 Epoxy Casting Binder 828 3061

EPON™ Resin 828 / EPIKURE™ Curing Agent 3061 Introduction This epoxy system is formulated for use as a binder in casting compounds capable of application and cure in unusually large mass sizes with minimal exotherm and shrinkage. Typical of such applications is the casting of large tooli

Recipe

SF 7016 High Tg Compound 828 1001F

EPON™ Resin 828 and 1001F Introduction This formulation illustrates the use of phthalic anhydride as a curing agent for epoxy resins when used in high service temperature encapsulations. Formula Material Supplier Pounds Gallons Resin Portion EPON Resin 828 Hexion 60.0 6.19 EPON Resin 1001F Hex

Recipe

SF 7017 Potting Compound 826

EPON™ Resin 826 Introduction This formulation illustrates the use of filler combinations in attaining a low coefficient of expansion in an epoxy potting compound. Suggested Uses Molded parts such as sand-core boxes for foundry work, pipe fitting, cases, and housings Electrical insulation such

Recipe

SF 7018 General Purpose Potting Compound 828

EPON™ Resin 828 Introduction This anhydride based formulation is designed for general purpose use in the encapsulation of metal or non-metallic electronic components. Suggested Uses Molded parts such as sand-core boxes for foundry work, pipe fitting, cases, and housings Electrical insulation s

Recipe

SF 7019 Thermal Shock Resistant Compound 828 505

EPON™ Resin 828 / HELOXY™ Modifier 505 Introduction This medium viscosity, long pot life, filled encapsulating formulation is designed for components requiring good thermal shock resistance. Features Medium Viscosity Good thermal shock resistance Long pot life Formula Material Supplier P

Recipe

SF 8000 Pre-Preg Laminating Compound SU-8

EPON™ Resin SU-8 Introduction A high functionality resin, EPON Resin SU-8 is employed in conjunction with dicyandiamide, (dicy) solvents and a latent accelerator in this formulation for a prepreg laminating solution. Suggested Uses Printed circuit boards; NEMA G-11 specification Thin laminates

Recipe

SF 8001 Solventless Pre-Preg Matrix 828

EPON™ Resin 828 Introduction This solventless epoxy binder is designed for prepreg graphite or glass tape and sheet stock subsequently compression molded into high performance composites required to perform on a long term basis at temperatures as high as 300 °F. A variation of this formula

Recipe

SF 8002 Flame Laminating Compound SU-8and1163

EPON™ Resin SU-8 and 1163 Introduction A combination of EPON Resin SU-8 high functionality epoxy resin and EPON Resin 1163 brominated epoxy resin are used in this formuation for finished laminates. Suggested Uses Printed circuit boards qualifying under the NEMA G-11 and FR-5 specifications Thi

Recipe

SF 8003 Low Laminating Compound SU-3

EPON™ Resin SU-3 Introduction This laminating compound is designed for the preparation of glass cloth pre-preg possessing a drapable, tacky consistency capable of low pressure fabrication into high strength laminates complying with the performance requirements of MIL-R-9300, Type I. Utility of

Recipe

SF 8004 Pre-Preg Matrix SU-3andSU-8

EPON™ Resin SU-3 and SU-8 Introduction This epoxy binder system is designed for prepreg tape, sheet, or chopped roving stock utilizing graphite, boron or glass fiber reinforcement for applications requiring long term performance at temperatures as high as 350 °F. Composites fabricated by vacuum

Recipe

SF 8005 Laminating Compound SU-8andSU-3

EPON™ Resin SU-8 and SU-3 Introduction This laminating compound is designed for the preparation of drapable, tacky pre-pregs reinforced with fiberglass, graphite, boron, and other high strength fibers for fabrication by low pressure molding techniques into high temperature composites meeting t

Recipe

SF 8006 Pre-Preg Matrix System SU-3

EPON™ Resin SU-3 Introduction This epoxy binder system is designed for the fabrication of glass, graphite or boron prepreg tape and sheet stock used in composites and insulation rated for long-term service at temperatures of 350 °F and above. Modification of this matrix with Hycar CTBN can

Recipe

SF 8007 High Matrix System SU-3 and 828

EPON™ Resin SU-3 and 828 Introduction This solventless epoxy binder is designed for graphite or glass fiber, and boron filament reinforced composites required to withstand extended service temperatures of 177 °C and time periods up to 1,000 hours at 260°C. The formulation is sufficient

Recipe

SF 8009 Wet Laminating Binder 828 and 8132 3295

EPON™ Resin 828 and 8132 / EPIKURE™ Curing Agent 3295 Introduction This formulation is for a room temperature curing, laminating binder designed for tooling and other structural applications. A reactive diluent with a low potential for skin irritation and a nonfuming aliphatic amine curi

Recipe

SF 8012 Epoxy Body Solder 1001F

EPON™ Resin 1001F Introduction This formulation is designed to meet handling properties characterized by conventional stick solder applications and to yield superior adhesion and durability. This compound will adhere to most metal surfaces. Formula Material Supplier Pounds Gallons EPON Resin 1

Recipe

SF 8013 Pre-Preg Matrix Solvent SU-8

EPON™ Resin SU-8 Introduction This compound is designed for the impregnation of bi-directional fiber cloth or uni-directional tape to form a tacky, drapable prepreg capable of low pressure molding into composites conforming with the requirements of MIL-R-9300, Type II. Pre-preg stock fabricate

Recipe

SF 8014 Hand FRP Matrix 862 68 3234

EPON™ Resin 862 / HELOXY™ Modifier 68 / EPIKURE™ Curing Agent 3234 Introduction This hand lay-up system allows for high filler loading due to its low viscosity. This capability allows this system to be used both as a laminating resin and as an adhesive system. Suggested Uses Pipe f

Recipe

SF 8017 Epoxy Resin System 826 862 LS-81K

EPON™ Resin 826 or EPON™ Resin 862 / LS-81K Anhydride Curing Agent (MTHPA) Introduction EPON Resin 826 or EPON Resin 862/LS-81K Curing Agent system is based on an epoxy resin cured with an anhydride. LS-81K Curing Agent is a formulated methyltetrahydrophthalic anhydride (MTHPA) containin

Recipe

SF 8024 Resin System 828 9552

EPON™ Resin 828 / EPIKURE™ Curing Agent 9552 Introduction EPIKURE Curing Agent 9552 is a fast, room-temperature curing, low viscosity liquid, aliphatic amine. Resins cured with EPIKURE Curing Agent 9552 produce outstanding toughness characteristics. Suggested Uses Composites Coatings Str

Recipe

SF 9000 - Epoxy Dispersion Formulations Cured with Dicyandiamide

EPI-REZ™ Resins 3522-W-60, 5520-W-60, 5003-W-53 and WD-510 Introduction EPI-REZ™ Resin 3522-W-60, EPI-REZ Resin 5520-W-60 and EPI-REZ Resin 5003-W-55 are nonionic, completely aqueous dispersions of epoxy resins. EPI-REZ Resin WD-510 is a liquid, Bisphenol A epoxy resin specifically desig

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