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Epoxy Systems for Composites and Electronics Adhesives

Our highly specialized, high-functionality epoxy resin systems can be formulated to meet customers' most stringent requirements for mechanical performance and endurance in composite and electronics adhesive applications.

  • For composite-to-composite bonding, for electronics fixatives and component assembly
  • Tough, fatigue- and shock-resistant bonds
  • Fast cure
  • Sag-resistant application
  • Long-term temperature and mechanical stability
  • Good chemical and abrasion resistance
  • No VOC
  • Low chlorine content

Two-Component Epoxy/Amine Systems for Composites and Electronics

Epoxy Resin System Performance & Features
Mechanical
Properties
   Adhesion   Cure Speed   Substrates   Key Features  
Solvent-free Systems
EPIKOTE Resin 240 / EPIKURE Curing Agent F205
 
 
 
 
 
 
 
 
 
Metal, concrete
  • Suitable for bonding similar substrates
  • Standard, cost effective system
EPIKOTE Resin 240 / EPIKURE Curing Agent 3125A
 
 
 
 
 
 
 
 
 
Metal, concrete
  • Suitable for bonding different substrates
  • Improved flexibility
  • Standard, cost effective system
 
 
 
Good
 
 
 
Better
 
 
 
Best

For more information, speak with a Hexion representative.

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