Please confirm your preference
Americas
Europe, Middle East, Africa
Asia Pacific

Powder Coating and Molding Epoxy Resins

Hexion offers a variety of resins for powder coating and molding for:

The EPON™ Resin 2000 series of epoxy powder coating and molding resins includes difunctional BPA-based resins with melting points ranging from 80°C to 105°C and melt viscosities at 150°C from 20 to 120 Poise. In powder coating applications, these resins are typically preferred for:

  • Higher melt viscosities
  • Higher film thicknesses
ProductTypical PropertiesDescriptionApplication
WPE, g./eq.Viscocity at 25oC, cP(1)Melt Point, oCCoatingsConstructionCompositesAll Others(2)
EPON Resin 2002675 - 76010 - 1780 - 90Medium molecular weight solid BPA epoxy resin
 
 
EPON Resin 2004875 - 97518 - 2795 - 105Medium molecular weight solid BPA epoxy resin
 
RECOMMENDED:
 
HIGHLY RECOMMENDED:
 

1 40% wt. solution in methyl ethyl ketone
2 Other applications include adhesives, electrical castings, electrical laminates and fibers


For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.

Welcome to Hexion eSecurity
Your platform for receiving secure content.
If you've received a notification, you can validate its authenticity by going to our validation page.