


Our epoxy resins for metal coatings can be used to formulate one-component, liquid baking systems that can resist the most aggressive media and demanding sterilization processes. These systems have a long, successful history of use in the packaging industry and can be combined with a variety of crosslinking materials (phenolics, melamines, urea-formaldehyde resins, etc.) to protect, preserve, and decorate both external and internal packaging surfaces. Features include:
Hexion also offers a broad range of innovative, ultra-low emitting Bakelite phenolic resins for metal food packaging and industrial coatings. These special cross-linking resins allow manufacturers to include higher proportions of phenolic resins in their BPA-NI formulations for greater formulation flexibility, toughness and corrosion resistance.
Specific market applications for our phenolic and epoxy resins include:
For food packaging applications, whether direct or indirect, it is important to consult the appropriate regulations, including for the U.S. Food and Drug Administration, to determine the suitability of substances. A Hexion bulletin outlines more specific details about our epoxy resin and curing agent products for the United States market.
Cardura™ E10P glycidyl ester and VeoVa™ vinyl ester enhance coating performance in numerous industrial applications.
One-Component Epoxy Coatings (Baked Cure - Temperatures about 125°C)
Epoxy Resin System | Performance & Features | |||
---|---|---|---|---|
Adhesion | Flexibility | Chemical Resistance | Incidental Food Contact | |
Solvent-borne Systems | ||||
EPON Resin 1007F / EPIKURE Curing Agent 200-N-60 |
RECOMMENDED: | HIGHLY RECOMMENDED: |
For more information, speak with a Hexion representative. |
One-Component Epoxy Coatings (Baked Cure - Temperatures above 125°C)
Epoxy Resin System | Performance & Features | |||
---|---|---|---|---|
Adhesion | Flexibility | Chemical Resistance | Incidental Food Contact | |
Waterborne Epoxy Resins | ||||
EPI-REZ™ Resin 3540-WY-55 / EPIKURE™ Curing Agent 200-N-60 | ||||
EPI-REZ Resin 3546-WH-53 / EPIKURE Curing Agent 200-N-60 | ||||
EPI-REZ Resin 3547-WY-57 / EPIKURE Curing Agent 200-N-60 | ||||
EPI-REZ Resin 3522-W-60 / EPIKURE Curing Agent 921 Super | ||||
Solvent-free Systems | ||||
EPON™ Resin 1004F / EPIKURE Curing Agent P-101 | ||||
Solvent-borne Systems | ||||
EPON Resin 1007F / EPIKURE Curing Agent 200-N-60 |
Recommended | Highly Recommended |
For more information, speak with a Hexion representative. |
One-Component Epoxy Coatings (Baked Cure - Temperatures above 125°C)
Epoxy Resin System | Performance & Features | |||
---|---|---|---|---|
Adhesion | Flexibility | Chemical Resistance | Incidental Food Contact | |
Waterborne Epoxy Resins | ||||
EPI-REZ™ Resin 3540-WY-55 / EPIKURE™ Curing Agent 200-N-60 | ||||
EPI-REZ Resin 3546-WH-53 / EPIKURE Curing Agent 200-N-60 | ||||
EPI-REZ Resin 3547-WY-57 / EPIKURE Curing Agent 200-N-60 | ||||
Solvent-borne Systems | ||||
EPON Resin 1007F / EPIKURE Curing Agent 200-N-60 |
Recommended | Highly Recommended |
For more information, speak with a Hexion representative. |