


Americas
Europe, Middle East, Africa
Asia Pacific
Heat and moisture resistance is crucial for PCBs. Bakelite® and Durite™ high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for printed circuit boards (PCB). These resins provide:
To meet your specific application requirements and ease manufacturing, our technical team will tailor resin attributes, such as:
PRODUCT | BENEFIT | |||||
---|---|---|---|---|---|---|
Reduced Color | Improved Moisture Resistance | Low Dielectric Constant | Good Adhesion to Metals | High Temperature Stability | Flexible in Various Formulations | |
Durite™ SD-1508 | ||||||
Durite™ D_SD-1809 | ||||||
Durite™ SL-150B | ||||||
Durite™ SD-1731 | ||||||
Durite™ SD-1817 | ||||||
Durite™ SD-241A |