Phenolic Resin Systems for Printed Circuit Boards (PCB)

Heat and moisture resistance is crucial for PCBs. Bakelite^® and Durite™ high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for printed circuit boards (PCB). These resins provide:

• High temperature stability
• Increased moisture resistance
• Low electrical conductivity
• Better copper adhesion

To meet your specific application requirements and ease manufacturing, our technical team will tailor resin attributes, such as:

• Softening point
• Hydroxyl equivalent
• Glass transition temperature
• Molecular weight and
• Viscosity