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Phenolic Resin Systems for Printed Circuit Boards (PCB)

Heat and moisture resistance is crucial for PCBs. Bakelite® and Durite™ high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for printed circuit boards (PCB). These resins provide:

  • High temperature stability
  • Increased moisture resistance
  • Low electrical conductivity
  • Better copper adhesion

To meet your specific application requirements and ease manufacturing, our technical team will tailor resin attributes, such as:

  • Softening point
  • Hydroxyl equivalent
  • Glass transition temperature
  • Molecular weight and
  • Viscosity

ProductBenefit
 Reduced ColorImproved Moisture ResistanceLow Dielectric ConstantGood Adhesion to MetalsHigh Temperature StabilityFlexible in Various Formulations
Durite Resin SD-1508
 
 
Durite Resin D_SD-1809
 
 
Durite Resin SL-150B
 
Durite Resin SD-1731
 
Durite Resin SD-1817
 
 
Durite Resin SD-241A