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Halogenated and Non-halogenated Resins for Electrical Laminating

EPIKOTE™ electrical laminating resin from Hexion is a reactive, halogen-containing material used to impart flammability resistance to printed circuit boards and their prepregs, as well as copper clad laminates.

In addition, high molecular weight brominated epoxy oligomeric resins can be used as flame retarding agents for thermoplastic polymers. A wide variety of these resins are available for 150 to 180°C Tg applications.

EPIKOTE electrical laminating resin may be cured using either Dicycanamide (DICY) or novolac curing agents. Both one-part (resin plus novolac curing agent) and two-part (resin, with a DICY or novolac curing agent in a second package) systems are available.

Hexion’s novolac-cured electrical laminating resin is suitable for the higher temperature requirements of printed circuit board processing. This resin offers:

  • Excellent thermal stability
  • Good conductive anodic filament (CAF) resistance
  • Fast processing

Halogenated and Non-halogenated Epoxy Resin

ProductTypical PropertiesDescriptionApplication
Resin TypeViscocity @25oC, cPWPE, g./eq.CoatingsConstructionCompositesAll Others(1)
EPIKOTE™ Resin 1163Brominated BPA epoxy100 – 1200(2)380 – 410Low melting solid epoxy with 48% by weight bromine. Softening point at 64°C. Imparts fire retardancy.
 
 
RECOMMENDED:
 
HIGHLY RECOMMENDED:
 

1 Other applications include adhesives, electrical castings, electrical laminates and fibers

2 @ 120°C


For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.