Please confirm your preference
Américas
EMEA
Asia Pacific

Powder Coating and Molding Epoxy Resins, and Electrical Grade Epoxy Resins

Hexion offers a variety of resins for powder coating and molding for:

The EPON™ Resin 2000 series of epoxy powder coating and molding resins includes difunctional and multifunctional BPA based resins with melting points ranging from 80°C to 120°C and melt viscosities at 150°C from 20 to 600 Poise. In powder coating applications, these resins are typically preferred for higher melt viscosities and higher film thicknesses.

We also offer the EPON Resin 3000 series of solid resins with characteristics for electrical encapsulation including:

  • Low chloride
  • Sinter resistance
  • Good reactivity
  • Excellent wet-out
ProductTypical PropertiesDescriptionApplication
WPE, g./eq.Viscocity at 25oC, cP(1)Melt Point, oCCoatingsConstructionCompositesAll Others(2)
EPON Resin 2002675 - 76010 - 1780 - 90Medium molecular weight solid BPA epoxy resin
 
 
EPON Resin 2003725 - 82514 - 1890 - 95Medium molecular weight solid BPA epoxy resin
 
EPON Resin 2004875 - 97518 - 2795 - 105Medium molecular weight solid BPA epoxy resin
 
EPON Resin 20051200 - 140026 - 55110 - 120Moderately high molecular weight solid BPA epoxy resin
 
EPON Resin 2014750 - 85035 - 75100 - 120Multifunctional resin for improved chemical resistance
 
EPON Resin 2024850 - 95017 - 2695 - 105Medium molecular weight BPA based resin formulated with a flow control agent
 
EPON Resin 3002520 - 5907.4 - 9.575 - 80Low chloride, sinter resistant grade for electrical applications
 
RECOMMENDED:
 
HIGHLY RECOMMENDED:
 

1 40% wt. solution in methyl ethyl ketone
2 Other applications include adhesives, electrical castings, electrical laminates and fibers


For more information, see Starting Formulations, Technical Data Sheets, or speak with a representative.