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Durite™ Resin D_PD-1623

Description

High purity cresol formaldehyde novolac resin

Application

D_PD-1623 is a low molecular weight resin used in semiconductor photoresist applications

Typical Properties

Property Standard Value Unit Test Method
Appearance Crushed solid
Average Molecular Weight GPC ca. 4500 – 5500 g/mol
Bulk Dissolution Rate 2.38% TMAH Developer, PAB 110°C/60 seconds ca. 95 - 195 Å/sec
Free Cresol Content GC 1 %
Individual Trace Metal Content GFAA max 500 ppb

Tests are made in accordance with the current Hexion Standard Test Method and are available upon request.

 
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