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Durite™ Resin D_PD-1642

Description

High purity cresol formaldehyde resin

Application

D_PD-1642 is used in semiconductor photoresist applications

Typical Properties

 

Target Value 

 

D_PD-1642LD

D_PD-1642

D_PD-1642 Fast

Appearance

Crushed solid

Bulk dissolution rate, 2.38% TMAH developer, PAB 110°C/60 seconds

ca. 80 - 180Å/sec

ca. 180 - 380Å/sec

ca. 380 - 580Å/sec

Free cresol content, GC

max 1.0%

Individual trace metal content, GFAA

max 500 ppb

Tests are made in accordance with the current Hexion Standard Test Method and are available upon request.

 
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