Americas
Europe, Middle East, Africa
Asia Pacific
High purity cresol formaldehyde resin
D_PD-1642 is used in semiconductor photoresist applications
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Target Value |
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D_PD-1642LD |
D_PD-1642 |
D_PD-1642 Fast |
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Appearance |
Crushed solid |
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Bulk dissolution rate, 2.38% TMAH developer, PAB 110°C/60 seconds |
ca. 80 - 180Å/sec |
ca. 180 - 380Å/sec |
ca. 380 - 580Å/sec |
Free cresol content, GC |
max 1.0% |
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Individual trace metal content, GFAA |
max 500 ppb |
Tests are made in accordance with the current Hexion Standard Test Method and are available upon request.