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Durite™ Resin PD-427A

Description

High purity cresol formaldehyde resin

Application

PD-427A is used in semiconductor photoresist applications

Typical Properties

Target Value 

PD-427A Slow

PD-427A Fast

Appearance

Crushed solid

Bulk dissolution rate, 2.38% TMAH developer, PAB 110°C/60 seconds

ca. 800 - 1700Å/sec

ca. 1700 - 2600Å/sec

Solution viscosity, 30% in PM acetate

32.0 – 44.0 cSt

25.0 – 37.0 cSt

Average molecular weight, GPC

ca. 4500 – 6000 g/mol

ca. 3500 – 5000 g/mol

Free cresol content, GC

max 1.0%

Individual trace metal content, GFAA

max 500 ppb

Tests are made in accordance with the current Hexion Standard Test Method and are available upon request. The typical properties provided are examples of product attributes and may not be tested.


 
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