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EPI-REZ™ Resin 3540-WY-55


EPI-REZ™ 3540-WY-55 Resin is a 55 percent solids dispersion of an EPON™ Resin 1007F in water and 2-propoxyethanol. This resin is designed for use in formulating industrial baking finishes, film adhesives/primers and fiber finishes/binders. When crosslinked with an appropriate resole, melamine or urea-formaldehyde resin and baked, epoxy coatings can be obtained that offer performance comparing favorably to solvent-borne epoxy coatings. This resin may also be used in industrial ambient cure primers in conjunction with waterborne EPIKURE™ amine curing agents that offer quick coalescing films with short lacquer dry times. 


  • May be formulated to low VOC coatings
  • Good adhesion to steel or aluminum
  • Compatible with a variety of aminoplast resins
  • Stable with a wide range of solvents
  • Nonionic stable dispersion of high molecular weight epoxy resin

Sales Specification

Property Standard Value Unit Test Method
Particle Size 0.35 - 0.85 microns SRC 00033
pH 7 - 10 ASTM E70
Solids 53.5 - 55.5 % ASTM D1259
Viscosity 7000 - 17000 cP ASTM D-2196
Weight per Epoxide 1600 - 2000 g/eq ASTM D1652

Typical Properties

Property Standard Value Unit Test Method
Appearance Opaque white liquid
Pounds/Gallon Solution 9 lbs/gal
Pounds/Gallon Solids 10.1 lbs/gal

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