Please confirm your preference
Americas
Europe, Middle East, Africa
Asia Pacific

EPON™ Resin 164

Description

EPON™ Resin 164 is a solid multifunctional epichlorohydrin/cresol novolac epoxy resin (see molecular structure). It combines the high thermal stability of the novolac backbone with the versatility, reactivity, and chemical resistance of epoxy resins. It is used where improved properties of cured epoxy resin systems are needed, particularly at elevated temperature and where stability of electrical properties under humid conditions are required. It finds application in electrical laminates, molding compounds, high performance aerospace composites, high temperature adhesives, powder coatings, and tooling.

Application

Effect of Resin Blends on Tg Figure 6 shows Tg’s for blends of EPON Resin 164 with EPON Resin 828. Generally, Tg’s increase linearly with EPON Resin 164 content because of its higher functionality. Systems cured with catalysts, aromatic amines, and NMA have similarly high Tg’s, indicating usefulness for high temperature adhesives and composites. The system with CRJ-406 phenolic curative has relatively lower Tg (but still >200 °C) but appears to be a tougher system that should be especially useful for molding compounds.

Figure 6 / Tg’s1for Blends of EPON Resin 164 with EPON Resin 828 with Several Curing Agents

EPON 164 Figure 6

                        1Tg’s by DSC. Cure, Hrs/°C = 2/150 = 2/200

Figure 7 gives the Tg’s of blends of EPON Resin 164 with EPON Resin 1123-A-80 (solution of a solid brominated laminating resin) or 828. In either case Tg can be raised ca. 10 °C with 20%w addition of EPON Resin 164. Chemical resistance is also improved and hence there is utility in high performance electrical laminate applications. It is noteworthy that the Tg for 100 percent EPON Resin 164 cured with dicyandiamide (Figure 7) is high (195 °C). This system has potential for adhesives, prepeg, and other structural uses.

Figure 7 / Tg’s1for Blends of EPON Resin 164 with EPON Resin 1123-A-80 (Brominated Electrical Laminating Resin) and EPON Resin 828

EPON 164 Figure 7

                                           1Tg’s by DSC. Cure, Hrs/°C = 2/150 = 2/200

Molding Powder – Table 3 shows typical properties for molding powders made from EPON Resin 164 using CRJ-406 phenolic curative plus high (silica) filler loading. These filled EPON Resin 164 molding powders also display high Tg, flexural strength, and excellent electrical properties.

Table 3 / Effect of EPON Resin 164 Content on HDT and Tg of an Electrical Molding Powder1

 

Units

A

B

C

D

EPON Resin 164

pbw

100

70

30

0

EPON Resin 1002F

pbw

0

30

70

100

HDT

°C

190

177

133

108

Tg

°C

201

182

145

122

1 These molding powders were 70%w silica flour and 30%w catalyzed resin. The catalyzed resin contained 100 parts EPON Resins 164 plus 1002F, 0.2 phr 2-methylimidazole accelerator, and varying amounts of CRJ-406 curative as follows 53, 43, 30, and 20 phr respectively.

Table 4 shows thermal properties for molding compounds like those in Table 3 using blends of EPON Resin 164 with EPON Resin 1002F. Tg can be varied from 122-201 °C depending upon needs, HDT varies between 108-190 °C and is always 5-15 °C lower than the Tg due to stress loading.

Table 4 / Properties for EPON Resin 164 Molding Powder1

 

Method

Units

A

EPON Resin 164

 

pbw

19.60

CRJ-406

 

pbw

10.40

2-Methylimidazole

 

pbw

0.08

Silica Flour

 

pbw

70.00

 

 

 

 

Cured State Properties

 

 

 

Tg by Rheometrics 2

ASTM D3418

°C

201

Flexural Strength at break

ASTM D790

MPa(psi)

123 (17,800)

Flexural Modulus

 

MPa(psi)

13,200 (1,900,000)

Coefficient of Thermal Expansion

 

 

 

50 °C to 201 °C

 

°C x 10-6 in/in

32

201 °C to 275 °C

 

°C x 10-6 in/in

79

Weight loss, 120 hrs at 200°C

 

% wt.

0.41

 

 

 

 

Electrical Properties

 

 

 

Dielectric constant 1 MHz

ASTM D150

 

3.8

Dissipation factor, 1 MHz

 

 

.011

Dielectric Strength

ASTM D149

Volts/mil

520

Volume Resistivity

 

ohm•cm

3.9 x 1015

 

 

 

 

1 1/8” molded plaques cured 5 minutes at 150 °C under 900 psi molding pressure, then postcured 16 hours at 177 °C.

2 This glass transition value was from tan delta max as measured by the Rheometrics Mechanical Spectrometer.

Figure 8 demonstrates the low moisture absorption and superiority of EPON Resin 164 in steam processing relative to a typical BPA/ECH epoxy molding compound. It is yet another reason for using EPON Resin 164 in harsh environments and electronic applications.

 Figure 8 / Moisture absorption in 15 PSIG steam for EPON Resin 164

EPON 164 Figure 8

Thin Film Powder Coatings – Figure 9 shows the increase in solvent resistance for powder coatings when EPON Resin 164 is added to the typical EPON Resin 2002 system. Solvent resistance as measured by MEK double rubs can be more than doubled by the addition of up to 17%w EPON Resin 164.

Figure 9 / Increase in Solvent Resistance with Added EPON Resin 164 in a Thin FilmPowder Coating

EPON 164 Figure 9

Strength Retention at High Temperature for Glass Cloth Laminates – Table 5 shows excellent high flexural strength properties for glass cloth reinforced laminates based upon EPON Resin 164 cured using DDS plus BF3 MEA auxiliary catalyst. Also, evident are a very high retention of strength (47%) and modulus (77%) at temperatures up to 225 °C. This high retention of strength, electrical, and other properties at elevated temperature is due to high crosslink densities obtained with EPON Resin 164 systems.

Table 5 / Flexural Properties of 8-Ply Glass Cloth Laminates 1

Composition

 

Units

Value

EPON Resin 164

 

pbw

100

DDS

 

pbw

27

BF3MEA

 

pbw

1

 

Temperature°C

Flexural Strength, MPa (PSI)

Flexural Modulus, MPa (psi)

Flexural Strain at break, %

23

570 (83,000)

24,000 (3,500,000)

2.4

150

500 (75,000)

22,000 (3,200,000)

2.4

200

340 (49,000)

19,500 (2,800,000)

2.2

225

270 (39,000)

19,000 (2,700,000)

2.2

 

 

 

 

1 Dry layup laminates, 35%w resin, cured 8 hours at 175 °C.
 

Benefits

  • An average of five reactive epoxide groups per molecule
  • Low ionic contaminants
  • Low saponifiable chloride
  • Easily ground into uniform particle size
  • Low melt viscosity
  • Stability on storage

Sales Specification

Property Standard Value Unit Test Method
Color 6 max. Gardner ASTM D1544
Epoxide Equivalent Weight 200 - 240 g/eq ASTM D1652
Viscosity at 25°C 35 - 50 cP ASTM D445

1 60% weight solution in MEK

Typical Properties

Property Standard Value Unit Test Method
Bulk Density 35 - 40 lb/ft³
Flash Point Setaflash 200 - 0 °F ASTM D3278
Free Chloride <1 ppm
Melt Viscosity at 150°C 600 - 1200 cSt ASTM D445, Cannon-Fenske
Melt Viscosity at 150°C 9 - 14 P ICI Cone & Plate
Melting Point at 1°C/min. 82 °C ASTM D-3461
Saponifiable Chloride <0.005 % wt.
Sodium <5 ppm
Solubility In Water Negligible
Tg by DSC 37 - 39 °C
Total Chloride 0 % wt.
Vapor Pressure at 25°C Negligible
Water As Manufactured 0.3 max. % wt.
Weight per Gallon at 20°C 10.2 lb/gal