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EPON™ Resin 2002

Description

EPON™ Resin 2002 is a solid bisphenol A/epichlorohydrin epoxy resin that is designed specifically for thin-film functional and decorative epoxy powder coating applications. Some examples of these applications are appliance finishes, decorative bottle coatings, and high performance finishes for automotive parts, metal shelving, and institutional furniture.

EPON Resin 2002 provides extended gelation time in epoxy powder coatings; however, it affords rapid cure speeds when combined with accelerated dicyandiamide curing agents. The resin’s low melt viscosity at baking temperatures provides outstanding flow characteristics and yields high gloss coatings.

For those powder coating applications requiring ultra-high flow characteristics, product can be selected from the lower range of the EPON Resin 2002 sales specifications. Please contact your Hexion Sales Representative for assistance.

Benefits

  • Provides controlled and extended gelation time in epoxy powder coatings to maximize flow and leveling.
  • Supplied in very large lots (greater than 100M pounds) with extremely uniform properties.
  • Exhibits superior color stability on over bake.
  • Filtered in the resin finishing operations of the manufacturing process to remove particulate contaminants.
  • Packaged in 50-pound net weight moisture barrier bags.

Sales Specification

特性 标准 单位 测试方法
Color 100 Pt-Co ASTM D1209
Viscosity at 25°C 10 - 17 cP ASTM D445
Weight per Epoxide 675 - 760 g/eq ASTM D1652

Typical Properties

特性 标准 单位 测试方法
Bulk Density 36 - 40 lbs/ft³
Density1 1.18 g/mL
Melt Viscosity at 150°C 20 - 40 P ASTM D2196

1Density of Powder Coating Material, The Powder Coating Institute, Recommended Procedure #4.