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EPIKURE Curing Agent P-101

Imidazole adduct for rapid or low temperature cures, useful as an accelerator for other curatives....

EPIKOTE Resin 896

Low viscosity epoxy resin blend based on a blend of a bisphenol F resin and a bisphenol A resin, containing a modification agent....

EPIKURE Curing Agent 8530-W-75

EPIKURE Curing Agent 8530-W-75is a water-reducible polyamine adduct supplied at 75% weight solids in water....

Durite Resin PD-0744LB

Durite Resin PD-0744LB is a slow-dissolving, high purity cresol formaldehyde novolac resin used in printing plate applications...

Durite Resin PD-1672

Durite Resin PD-1672 is a high purity cresol formaldehyde resin used in semiconductor photoresist applications....

Durite Resin RL-744C

Durite Resin RL-744C is a liquid phenolic resole resin in ethylene glycol suitable for use as a binder for refractory applications....

EPIKURE Curing Agent 3274

Low color. Provides blush and sweat-out free films. Applications include glaze and high build coatings, FRP, decoupage, encapsulation and casting compounds....

Self-leveling Flooring

Hexion epoxy resin systems and Versatic monomers provide a range of desirable performance characteristics to self-leveling flooring....

Durite Resin AL-5395

Durite Resin AL-5395 is a heat-reactive, one-step, liquid phenolic resin suitable as a wetting ("pick-up") agent for abrasive bonds....

EPIKURE Curing Agent 3072

Applications include floor toppings, grouts and adhesives for bonding old concrete to freshly poured concrete. Provides superior adhesion to damp concrete....

EPI-REZ Resin 6520-WH-53

Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001-type)with a non HAPS co-solvent....

EPIKURE Curing Agent 3175

Modified polyamide for high solids coatings. Offers rapid cure response, excellent chemical and solvent resistance....

Durite Resin D_SD-1809

Durite Resin D_SD-1809 is a low molecular weight phenol dicyclopentadiene condensate resin used in epoxy curing agents, epoxy intermediates and PCB assembly applications....

EPON Resin 58034

HELOXY Modifier 68 adducted with 50% carboxylated butadiene-acrylonitrile rubber. Provides low viscosity and high toughness for adhesives and sealants....

EPIKURE Curing Agent 3233

T403 polyoxypropylenetriamine that has moderate reactivity, low viscosity, low color, low vapor pressure and high primary amine content. It resists "blush", "bloom" and "sweat-out" in epoxy compositions....

EPIKURE Curing Agent 3271

Uses include rapid setting adhesives, cable splicing compounds, tooling, gel coats and low temperature applications....

Versatic™ Acids and Derivatives

Hexion Versatic acids and derivatives are highly versatile molecules used to improve paints, coatings, adhesives, lubricants and a variety of other products....

Cellobond Resin J6070L

Cellobond Resin J6070L is a liquid phenolic resole resin suitable for the production of foam for mining applications....

Durite Resin SD-1731

Durite Resin SD-1731 is a high purity phenolic novolac used in epoxy curing and PCB assembly applications....

EPIKURE Curing Agent 3270

Provides blush free films. Applications include adhesives and a modifier of curing agents for flooring and other structural applications....

Durite Resin FL-756A

Durite Resin FL-756A is a liquid phenolic resole resin in methyl ethyl ketone, used as a laminating varnish for composite laminate applications....

EPIKURE Curing Agent 3370

Applications include industrial and chemically resistant floor toppings, light colored casting and tank lining applications....

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