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EPON Resin 862

Unmodified Liquid Resin - Low viscosity, high performance alternative to blends of EPON Resin 828 and HELOXY Modifiers....

EPON Resin 826

Unmodified Liquid Resin -A low viscosity resin. Possesses performance properties similar to EPON Resin 828. Capable of accepting higher filler levels. Subject to crystallization when cold....

EPIKURE Curing Agent 3230

D230 polyoxypropylenediamine that has moderate reactivity, low viscosity, low color, low vapor pressure and high primary amine content. It resists blush, bloom and sweat-out in epoxy compositions....

CELLOBOND Resin J2042X

CELLOBOND Resin J2042X is a thixotropic liquid phenolic resole resin suitable for mass transit and aerospace composite applications....

EPIKURE Curing Agent 9553

EPIKURE Curing Agent 9553 Shelf Life Information...

Cellobond Resin J2027L

Cellobond Resin J2027L is aliquid phenolic resole resin suitablefor the manufacture of heat resistantcomposites and laminates....

EPIKURE Curing Agent 3140

Low viscosity for this class of curatives. Applications include adhesives and extending pot life of highly reactive amines....

EPIKURE Curing Agent 3277

Provides blush and sweat-out free films for flooring and high build coatings. Accommodates application on damp surfaces. Can be modified for underwater cure capability....

EPIKURE Curing Agent 3271

Uses include rapid setting adhesives, cable splicing compounds, tooling, gel coats and low temperature applications....

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