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EPON Resin 1002F

Fusion Solids -Sinter-resistant grade of EPON Resin 1001F...

EPON Resin 1007F

Fusion Solids -Moderately high molecular weight resin used for baked industrial coatings cured with urea- formaldehyde and phenol-formaldehyde resins....

EPON Resin 2005

Powder Coating / Molding Powder Solids -Standard BPA based resin, melt point 110-120C. Provides thicker films....

EPIKURE Curing Agent P-101

Imidazole adduct for rapid or low temperature cures, useful as an accelerator for other curatives....

EPON Resin 2004

Powder Coating / Molding Powder Solids -Standard BPA based resin, melt point 95-105C....

EPON Resin 2002

Powder Coating / Molding Powder Solids -Standard BPA based resin, melt point 80-90C....

EPON Resin 1001F

Fusion Solids -Basic coating and prepreg resin; sinters upont storage....

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