


Bakelite® and Durite™ phenolic/cresylic resins are an excellent alternative to traditional epoxy curing agents, especially for epoxy system users seeking high glass transition temperature (Tg), excellent stability at high operating temperatures, superior flame retardancy, and overall mechanical integrity. Product solutions are available for halogen-free systems. We offer our Bakelite epoxy resin curing agents in a range of viscosities and other parameters. Additionally, our technical expertise allows us to support customers by tailoring the resin’s reactive equivalents, molecular weight and softening points to meet specific application requirements. These products are typically used in the manufacture of copper-clad laminates (CCLs) for printed circuit boards (PCBs) and in other applications such as coatings and composites where mechanical integrity under high heat is critical.
PRODUCT | BENEFIT | ||||||
---|---|---|---|---|---|---|---|
IMPROVED SOLUTBILITY IN ORGANIC SOLVENT | IMPROVED MOISTURE RESISTANCE | LOW DIELECTRIC CONSTANT | ENHANCED FLUORESENCE | FLAME RETARDANCY IN HAOLGEN FREE SYSTEMS | INCREASED PEEL STRENGTH | INCREASED POTLIFE | |
Durite Resin SD-1817 | |||||||
Durite Resin SD-357B | |||||||
Durite Resin D_SD-1809 | |||||||
Durite Resin SD-1731 |